Tokyo
Japan
4
2025-11-20
The entities that hold a legal rights for patent applications filed by inventor HIEDA Daisuke:
Daisuke HIEDA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
METHOD FOR PRODUCING SUPPORT SUBSTRATE FOR BONDED WAFER, AND SUPPORT SUBSTRATE FOR BONDED WAFER
#2 | 2023-12-07METHOD FOR PRODUCING SUPPORT SUBSTRATE FOR BONDED WAFER, AND SUPPORT SUBSTRATE FOR BONDED WAFER
#3 | 2023-07-20SUPPORT SUBSTRATE FOR BONDED WAFER
#4 | 2016-10-13Susceptor, vapor deposition apparatus, vapor deposition method and epitaxial silicon wafer
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