Cupertino, California
United States
10
2016-11-03
The entities that hold a legal rights for patent applications filed by inventor CHEN Fusen E.:
Fusen E. CHEN from Cupertino, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Method for depositing a diffusion barrier layer and a metal conductive layer
#2 | 2011-10-20Method of depositing a uniform barrier layer and metal seed layer with reduced overhang over a plurality of recessed semiconductor features
#3 | 2010-10-07Method of depositing a uniform metal seed layer over a plurality of recessed semiconductor features
#4 | 2009-10-29Method of depositing a metal seed layer over recessed feature surfaces in a semiconductor substrate
#5 | 2008-07-10Method of depositing a sculptured copper seed layer
#6 | 2007-08-02Method for depositing a diffusion barrier layer and a metal conductive layer
#7 | 2007-01-25Method of depositing a metal seed layer on semiconductor substrates
#8 | 2005-07-19Method of preventing diffusion of copper through a tantalum-comprising barrier layer
#9 | 2005-04-21Method of depositing a metal seed layer on semiconductor substrates
#10 | 2005-01-27Method of depositing a diffusion barrier layer and a metal conductive layer
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