Mountain View, California
United States
11
2024-07-25
The entities that hold a legal rights for patent applications filed by inventor LEE Bongsub:
Bongsub LEE from Mountain View, US has applied for patents for these inventions. The list has both pending applications and granted patents:
STRUCTURES FOR BONDING ELEMENTS INCLUDING CONDUCTIVE INTERFACE FEATURES
#2 | 2023-03-02SEQUENCES AND EQUIPMENT FOR DIRECT BONDING
#3 | 2021-08-26Structures for bonding elements including conductive interface features
#4 | 2019-11-14Bonded structures
#5 | 2017-11-09Nanoscale interconnect array for stacked dies
#6 | 2017-06-15Fan-out wafer-level packaging using metal foil lamination
#7 | 2017-04-13Fan-out wafer-level packaging using metal foil lamination
#8 | 2017-03-09Wafer-level packaging using wire bond wires in place of a redistribution layer
#9 | 2017-02-09Methods and structures to repair device warpage
#10 | 2017-01-10Wafer level packages with mechanically decoupled fan-in and fan-out areas
#11 | 2016-11-03Wafer-level packaging using wire bond wires in place of a redistribution layer
1701010 ⎘