San Jose, California
United States
149
2026-05-12
149
2026-05-12
These are the the leading inventors for applications assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.:
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. based in San Jose, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Integrated cooling assembly with upper and lower channels and co-packaged optics
#2 | 2026-05-05 ✅ Patent 12,622,272 granted on 2026-05-05Two-sided liquid cooling
#3 | 2025-12-30 ✅ Patent 12,513,855 granted on 2025-12-30Integrated cooling assembly with upper and lower channels
#4 | 2025-10-23 ✅ Patent 12,500,138 granted on 2025-12-16COOLING CHANNEL SHAPE WITH SUBSTANTIALLY CONSTANT CROSS SECTIONAL AREA
#5 | 2025-10-02 ✅ Patent 12,532,432 granted on 2026-01-20HOTSPOT MITIGATION IN FLUID COOLING
#6 | 2025-09-09 ✅ Patent 12,412,808 granted on 2025-09-09Cold plate and manifold integration for high reliability
#7 | 2025-08-07 ✅ Patent 12,525,506 granted on 2026-01-13EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME
#8 | 2025-06-26 ✅ Patent 12,368,087 granted on 2025-07-22EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME
#9 | 2025-06-26 ✅ Patent 12,610,819 granted on 2026-04-21INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME
#10 | 2025-06-17 ✅ Patent 12,336,141 granted on 2025-06-17Cold plate cavity designs for improved thermal performance
#11 | 2025-06-03 ✅ Patent 12,322,677 granted on 2025-06-03Fluid channel geometry optimizations to improve cooling efficiency
#12 | 2025-04-22 ✅ Patent 12,283,490 granted on 2025-04-22Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same
#13 | 2025-04-01 ✅ Patent 12,266,545 granted on 2025-04-01Structures and methods for integrated cold plate in XPUs and memory
#14 | 2025-02-06 ✅ Patent 12,341,025 granted on 2025-06-24MICROELECTRONIC ASSEMBLIES
#15 | 2025-01-02 ✅ Patent 12,622,207 granted on 2026-05-05APPARATUS FOR SEPARATING SINGULATED DIE FROM SUBSTRATE DICING TAPE AND METHODS OF USING THE SAME
#16 | 2024-12-26 ✅ Patent 12,322,650 granted on 2025-06-03Diffusion barrier for interconnects
#17 | 2024-12-24 ✅ Patent 12,176,264 granted on 2024-12-24Manifold designs for embedded liquid cooling in a package
#18 | 2024-11-21 ✅ Patent 12,191,235 granted on 2025-01-07Integrated cooling assemblies including signal redistribution and methods of manufacturing the same
#19 | 2024-11-21 ✅ Patent 12,191,234 granted on 2025-01-07Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same
#20 | 2024-11-07 ✅ Patent 12,406,975 granted on 2025-09-02TECHNIQUES FOR PROCESSING DEVICES
#21 | 2024-10-03 ✅ Patent 12,176,263 granted on 2024-12-24Integrated cooling assembly including coolant channel on the backside semiconductor device
#22 | 2024-09-19 ✅ Patent 12,341,125 granted on 2025-06-24DIMENSION COMPENSATION CONTROL FOR DIRECTLY BONDED STRUCTURES
#23 | 2024-09-19 ✅ Patent 12,598,962 granted on 2026-04-07SYSTEM AND METHOD FOR BONDING TRANSPARENT CONDUCTOR SUBSTRATES
#24 | 2024-08-22 ✅ Patent 12,300,662 granted on 2025-05-13DBI to SI bonding for simplified handle wafer
#25 | 2024-08-08 ✅ Patent 12,341,083 granted on 2025-06-24ELECTRONIC DEVICE COOLING STRUCTURES
#26 | 2024-07-25 ✅ Patent 12,261,099 granted on 2025-03-25Embedded cooling systems with coolant channel for device packaging
#27 | 2024-07-18 ✅ Patent 12,266,640 granted on 2025-04-01Molded direct bonded and interconnected stack
#28 | 2024-07-18 ✅ Patent 12,381,168 granted on 2025-08-05CONDUCTIVE BARRIER DIRECT HYBRID BONDING
#29 | 2024-07-11 ✅ Patent 12,322,718 granted on 2025-06-03Bonded structure with interconnect structure
#30 | 2024-07-04 ✅ Patent 12,506,114 granted on 2025-12-23DIRECTLY BONDED METAL STRUCTURES HAVING ALUMINUM FEATURES AND METHODS OF PREPARING SAME
#31 | 2024-07-04 ✅ Patent 12,183,659 granted on 2024-12-31Embedded cooling assemblies for advanced device packaging and methods of manufacturing the same
#32 | 2024-07-04 ✅ Patent 12,199,011 granted on 2025-01-14Embedded liquid cooling
#33 | 2024-07-04 ✅ Patent 12,545,010 granted on 2026-02-10DIRECTLY BONDED METAL STRUCTURES HAVING ALUMINUM FEATURES AND METHODS OF PREPARING SAME
#34 | 2024-06-27 ✅ Patent 12,622,307 granted on 2026-05-05CONTROLLED GRAIN GROWTH FOR BONDING AND BONDED STRUCTURE WITH CONTROLLED GRAIN GROWTH
#35 | 2024-06-27 ✅ Patent 12,417,950 granted on 2025-09-16MITIGATING SURFACE DAMAGE OF PROBE PADS IN PREPARATION FOR DIRECT BONDING OF A SUBSTRATE
#36 | 2024-06-20 ✅ Patent 12,272,677 granted on 2025-04-08Direct bonded stack structures for increased reliability and improved yield in microelectronics
#37 | 2024-06-13 ✅ Patent 12,482,776 granted on 2025-11-25METAL PADS OVER TSV
#38 | 2024-06-06 ✅ Patent 12,438,122 granted on 2025-10-07DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER
#39 | 2024-05-23 ✅ Patent 12,176,294 granted on 2024-12-24Bonded structure with interconnect structure
#40 | 2024-05-16 ✅ Patent 12,308,332 granted on 2025-05-20Circuitry for electrical redundancy in bonded structures
#41 | 2024-05-02 ✅ Patent 12,266,650 granted on 2025-04-01Stacked dies and methods for forming bonded structures
#42 | 2024-04-25 ✅ Patent 12,218,107 granted on 2025-02-04Electrical redundancy for bonded structures
#43 | 2024-04-25 ✅ Patent 12,341,018 granted on 2025-06-24METHOD FOR PREPARING A SURFACE FOR DIRECT-BONDING
#44 | 2024-04-11 ✅ Patent 12,271,032 granted on 2025-04-08Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects
#45 | 2024-04-04 ✅ Patent 12,132,020 granted on 2024-10-29Low temperature bonded structures
#46 | 2024-03-28 ✅ Patent 12,153,222 granted on 2024-11-26Bonded optical devices
#47 | 2024-03-21 ✅ Patent 12,451,445 granted on 2025-10-21PROTECTIVE ELEMENTS FOR BONDED STRUCTURES
#48 | 2024-03-21 ✅ Patent 12,622,222 granted on 2026-05-05APPARATUS FOR PROCESSING OF SINGULATED DIES AND METHODS FOR USING THE SAME
#49 | 2024-03-14 ✅ Patent 12,347,820 granted on 2025-07-01STACKED DEVICES AND METHODS OF FABRICATION
#50 | 2024-03-14 ✅ Patent 12,205,926 granted on 2025-01-21TSV as pad
#51 | 2024-03-07 ✅ Patent 12,176,303 granted on 2024-12-24Wafer-level bonding of obstructive elements
#52 | 2024-02-29 ✅ Patent 12,033,943 granted on 2024-07-09Laterally unconfined structure
#53 | 2024-02-08 ✅ Patent 12,125,784 granted on 2024-10-22Interconnect structures
#54 | 2024-02-01 ✅ Patent 12,191,233 granted on 2025-01-07Embedded cooling systems and methods of manufacturing embedded cooling systems
#55 | 2024-01-18 ✅ Patent 12,300,661 granted on 2025-05-13Reliable hybrid bonded apparatus
#56 | 2024-01-18 ✅ Patent 12,431,460 granted on 2025-09-30DIE PROCESSING
#57 | 2024-01-04 ✅ Patent 12,243,851 granted on 2025-03-04Offset pads over TSV
#58 | 2023-12-28 ✅ Patent 12,046,583 granted on 2024-07-23Electrical redundancy for bonded structures
#59 | 2023-12-28 ✅ Patent 12,564,084 granted on 2026-02-24BONDED STRUCTURES WITHOUT INTERVENING ADHESIVE
#60 | 2023-12-28 ✅ Patent 12,046,569 granted on 2024-07-23Integrated device packages with integrated device die and dummy element
#61 | 2023-12-28 ✅ Patent 12,381,119 granted on 2025-08-05SEAL FOR MICROELECTRONIC ASSEMBLY
#62 | 2023-12-07 ✅ Patent 12,431,449 granted on 2025-09-30CIRCUITRY FOR ELECTRICAL REDUNDANCY IN BONDED STRUCTURES
#63 | 2023-11-23 ✅ Patent 12,591,005 granted on 2026-03-31TESTING ELEMENTS FOR BONDED STRUCTURES
#64 | 2023-11-09 ✅ Patent 12,100,684 granted on 2024-09-24Bonded structures
#65 | 2023-11-09 ✅ Patent 12,198,981 granted on 2025-01-14Diffusion barrier collar for interconnects
#66 | 2023-10-26 ✅ Patent 12,512,425 granted on 2025-12-30EXPANSION CONTROLLED STRUCTURE FOR DIRECT BONDING AND METHOD OF FORMING SAME
#67 | 2023-10-05 ✅ Patent 12,451,439 granted on 2025-10-21PROTECTIVE ELEMENTS FOR BONDED STRUCTURES
#68 | 2023-10-05 ✅ Patent 12,057,383 granted on 2024-08-06Bonded structures with integrated passive component
#69 | 2023-09-07 ✅ Patent 12,401,011 granted on 2025-08-26STACKED DEVICES AND METHODS OF FABRICATION
#70 | 2023-09-07 ✅ Patent 12,068,278 granted on 2024-08-20Processed stacked dies
#71 | 2023-08-24 ✅ Patent 12,381,173 granted on 2025-08-05CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
#72 | 2023-08-24 ✅ Patent 12,046,571 granted on 2024-07-23Low temperature bonded structures
#73 | 2023-08-10 ✅ Patent 12,564,106 granted on 2026-02-24TECHNIQUES FOR JOINING DISSIMILAR MATERIALS IN MICROELECTRONICS
#74 | 2023-08-10 ✅ Patent 11,837,582 granted on 2023-12-05Molded direct bonded and interconnected stack
#75 | 2023-07-06 ✅ Patent 12,667,031 granted on 2026-06-23DIRECT BONDING ON PACKAGE SUBSTRATES
#76 | 2023-07-06 ✅ Patent 12,046,482 granted on 2024-07-23Microelectronic assemblies
#77 | 2023-06-29 ✅ Patent 12,642,110 granted on 2026-05-26MULTI-CHANNEL DEVICE STACKING
#78 | 2023-06-29 ✅ Patent 12,199,069 granted on 2025-01-14Heterogeneous annealing method and device
#79 | 2023-06-22 ✅ Patent 12,543,568 granted on 2026-02-03THERMOELECTRIC COOLING FOR DIE PACKAGES
#80 | 2023-05-11 ✅ Patent 12,563,749 granted on 2026-02-24STACKED ELECTRONIC DEVICES
#81 | 2023-05-04 ✅ Patent 12,604,771 granted on 2026-04-14DIRECT BONDING METHODS AND STRUCTURES
#82 | 2023-04-27 ✅ Patent 11,837,596 granted on 2023-12-05Stacked dies and methods for forming bonded structures
#83 | 2023-04-27 ✅ Patent 12,113,056 granted on 2024-10-08Stacked dies and methods for forming bonded structures
#84 | 2023-03-30 ✅ Patent 12,543,577 granted on 2026-02-03BONDED STRUCTURE WITH ACTIVE INTERPOSER
#85 | 2023-02-02 ✅ Patent 12,300,634 granted on 2025-05-13Protective semiconductor elements for bonded structures
#86 | 2023-01-12 ✅ Patent 12,374,556 granted on 2025-07-29PROCESSING STACKED SUBSTRATES
#87 | 2022-12-29 ✅ Patent 12,322,667 granted on 2025-06-03Seal for microelectronic assembly
#88 | 2022-11-24 ✅ Patent 12,374,656 granted on 2025-07-29MULTI-CHIP MODULES FORMED USING WAFER-LEVEL PROCESSING OF A RECONSTITUTED WAFER
#89 | 2022-11-24 ✅ Patent 12,174,246 granted on 2024-12-24Security circuitry for bonded structures
#90 | 2022-11-17 ✅ Patent 11,948,847 granted on 2024-04-02Bonded structures
#91 | 2022-10-06 ✅ Patent 12,525,572 granted on 2026-01-13DIRECT BONDING AND DEBONDING OF CARRIER
#92 | 2022-10-06 ✅ Patent 12,550,799 granted on 2026-02-10DIRECT BONDING METHODS AND STRUCTURES
#93 | 2022-09-22 ✅ Patent 11,955,445 granted on 2024-04-09Metal pads over TSV
#94 | 2022-09-22 ✅ Patent 11,848,284 granted on 2023-12-19Protective elements for bonded structures
#95 | 2022-09-15 ✅ Patent 11,955,463 granted on 2024-04-09Direct bonded stack structures for increased reliability and improved yield in microelectronics
#96 | 2022-09-08 ✅ Patent 11,978,681 granted on 2024-05-07Mitigating surface damage of probe pads in preparation for direct bonding of a substrate
#97 | 2022-09-08 ✅ Patent 12,051,621 granted on 2024-07-30Microelectronic assembly from processed substrate
#98 | 2022-08-11 ✅ Patent 11,830,838 granted on 2023-11-28Conductive barrier direct hybrid bonding
#99 | 2022-08-04 ✅ Patent 11,967,575 granted on 2024-04-23Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes
#100 | 2022-08-04 ✅ Patent 12,456,662 granted on 2025-10-28STRUCTURES WITH THROUGH-SUBSTRATE VIAS AND METHODS FOR FORMING THE SAME
Also check out ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.'s (San Jose, United States) applicant profile with 319 patent applications submitted.
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