Unterhaching
Germany
21
2023-09-07
The entities that hold a legal rights for patent applications filed by inventor Daeche Frank:
Frank Daeche from Unterhaching, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
POWER ELECTRONIC ASSEMBLY AND POWER MODULE FOR EMBEDDING IN A PRINTED CIRCUIT BOARD
#2 | 2023-07-27Power electronic assembly having a laminate inlay and method of producing the power electronic assembly
#3 | 2023-04-27Power semiconductor system having an inductor module attached to a power stage module
#4 | 2022-12-22Power semiconductor module for PCB embedding, power electronic assembly having a power module embedded in a PCB, and corresponding methods of production
#5 | 2021-10-07Method for fabricating a semiconductor package, semiconductor package and embedded PCB module
#6 | 2021-04-29Power electronic assembly and method of producing thereof
#7 | 2021-02-04Method of manufacturing a power semiconductor system
#8 | 2020-09-03Semiconductor arrangement, laminated semiconductor arrangement and method for fabricating a semiconductor arrangement
#9 | 2020-07-02Methods of manufacturing inductor modules and power semiconductor systems having inductor modules
#10 | 2020-01-30Chip assembly and method of manufacturing thereof
#11 | 2019-03-14Power semiconductor systems having inductor modules, and methods of manufacturing inductor modules and power semiconductor systems having inductor modules
#12 | 2017-12-21Semiconductor packages and methods of fabrication thereof
#13 | 2017-09-21Semiconductor device including a passive component formed in a redistribution layer
#14 | 2015-10-01Chip package and method for manufacturing the same
#15 | 2014-09-18Chip package and method for manufacturing the same
#16 | 2014-05-29Semiconductor packages and methods of fabrication thereof
#17 | 2013-04-04Integrated circuit package and a method for manufacturing an integrated circuit package
#18 | 2012-11-29Power Semiconductor Module with Embedded Chip Package
#19 | 2012-11-15Integrated circuit package and packaging methods
#20 | 2012-11-15Integrated circuit package and packaging methods
#21 | 2012-06-14Die arrangement and method of forming a die arrangement
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