Rowley, Massachusetts
United States
29
2024-07-04
The entities that hold a legal rights for patent applications filed by inventor Scheuer Jay T.:
Jay T. Scheuer from Rowley, US has applied for patents for these inventions. The list has both pending applications and granted patents:
XRAY DIFFRACTION ANGLE VERIFICATION IN AN ION IMPLANTER
#2 | 2024-07-04XRAY DIFFRACTION ANGLE VERIFICATION IN AN ION IMPLANTER
#3 | 2023-11-30Systems and methods for optimizing full horizontal scanned beam distance
#4 | 2023-04-27Mismatched optics for angular control of extracted ion beam
#5 | 2023-03-16Device to control uniformity of extracted ion beam
#6 | 2023-03-16Variable thickness ion source extraction plate
#7 | 2022-02-03Particle yield via beam-line pressure control
#8 | 2021-12-09Ion source with single-slot tubular cathode
#9 | 2021-09-16Ion source with single-slot tubular cathode
#10 | 2021-06-17Electrostatic filter providing reduced particle generation
#11 | 2021-01-14In-situ plasma cleaning of process chamber components
#12 | 2020-06-18Cylindrical shaped arc chamber for indirectly heated cathode ion source
#13 | 2020-04-23In-situ plasma cleaning of process chamber components
#14 | 2018-06-14RF clean system for electrostatic elements
#15 | 2017-08-03Apparatus and method for in-situ cleaning in ion beam apparatus
#16 | 2017-06-20Apparatus and method for contamination control in ion beam apparatus
#17 | 2017-03-30IN-SITU PLASMA CLEANING OF PROCESS CHAMBER ELECTROSTATIC ELEMENTS HAVING VARIED GEOMETRIES
#18 | 2017-03-02Liquid immersion doping
#19 | 2016-12-15In-situ plasma cleaning of process chamber components
#20 | 2011-02-10COLD IMPLANT FOR OPTIMIZED SILICIDE FORMATION
#21 | 2010-06-24METHOD AND APPARATUS FOR PLASMA DOSE MEASUREMENT
#22 | 2009-10-01Flexible ion source
#23 | 2009-07-02RF electron source for ionizing gas clusters
#24 | 2008-07-03METHOD AND APPARATUSES FOR PROVIDING ELECTRICAL CONTACT FOR PLASMA PROCESSING APPLICATIONS
#25 | 2008-01-31Monitoring plasma ion implantation systems for fault detection and process control
#26 | 2006-10-24Wafer platen equipped with electrostatic clamp, wafer backside gas cooling, and high voltage operation capability for plasma doping
#27 | 2006-05-11Plasma implantation using halogenated dopant species to limit deposition of surface layers
#28 | 2006-03-02Reduction of source and drain parasitic capacitance in CMOS devices
#29 | 2005-09-22Plasma immersion ion implantion apparatus and method
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