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Inventor profile of:

Hideyuki KONDO

City:

Tokyo

Country:

Japan

Published Applications:

5

Last publication date:

2019-07-04

Top Assignees for applications by Hideyuki KONDO

The entities that hold a legal rights for patent applications filed by inventor KONDO Hideyuki:

  • SHOWA DENKO K.K. 4 Tokyo, Japan
  • SUMITOMO MITSUBISHI SILICON CORPORATION 1 Tokyo, Japan
  • SUMCO CORPORATION 1 Tokyo, Japan

Recent patent applications by KONDO Hideyuki

Hideyuki KONDO from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2019-07-04
US20190204278A1
Physics

LIQUID CHROMATOGRAPHY PACKING MATERIAL

#2 | 2019-01-17
US20190015813A1
Performing operations; transporting

PACKING MATERIAL FOR LIQUID CHROMATOGRAPHY AND COLUMN FOR LIQUID CHROMATOGRAPHY

#3 | 2018-08-23
US20180238842A1
Physics

LIQUID CHROMATOGRAPHIC COLUMN AND LIQUID CHROMATOGRAPHIC APPARATUS INCLUDING THE SAME

#4 | 2017-01-12
US20170007981A1
Performing operations; transporting

PACKING MATERIAL FOR LIQUID CHROMATOGRAPHY AND COLUMN FOR LIQUID CHROMATOGRAPHY

#5 | 2006-11-09
US20060249479A1
Physics

Inspection method, manufacturing method of piece for analysis, analysis method, analyzer, manufacturing method of SOI wafer, and SOI wafer

InventorID:

1766254 ⎘

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