Michael J. Ries

City:

St. Charles, Missouri

Country:

United States

Published Applications:

Last publication date:

2017-01-26

Top Assignees for applications by Michael J. Ries

The entities that hold a legal rights for patent applications filed by inventor Ries Michael J.:

MEMC Electronic Materials, Inc. 3 St. Peters, MO United States
GLOBALWAFERS CO., LTD. 1 Hsinchu, Taiwan
SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H) 1 Singapore, Singapore
SunEdison Semiconductor Limited 1 St. Peters, MO United States

Recent patent applications by Ries Michael J.

Michael J. Ries from St. Charles, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2017-01-26

US20170025307A1

Electricity

Methods for preparing layered semiconductor structures

#2 | 2012-01-05

US20120003814A1

Electricity

Methods for in-situ passivation of silicon-on-insulator wafers

#3 | 2010-05-27

US20100130021A1

Electricity

METHOD FOR PROCESSING A SILICON-ON-INSULATOR STRUCTURE

#4 | 2006-04-13

US20060075960A1

Electricity

Method for the preparation of a semiconductor substrate with a non-uniform distribution of stabilized oxygen precipitates

InventorID:

1781732 ⎘