Bilal Khalaf

APPARATUS TO HOLD ELECTRICAL COMPONENTS THAT ACCOMMODATES MULTIPLE ELECTRICAL COMPONENT SIZES

METHODS AND SYSTEMS FOR CONTROLLING HEIGHTS OF DEVICE PACKAGES

METHODS AND SYSTEMS FOR CONTROLLING UNDERFILL BLEED-OUT IN SEMICONDUCTOR PACKAGING

REDUCING PRINTED CIRCUIT BOARD AREA FOR SINGLE-SIDED PRINTED CIRCUIT BOARD

Embedded component and methods of making the same

Microelectronic packages having a die stack and a device within the footprint of the die stack

Buried electrical debug access port

Microelectronic packages having a die stack and a device within the footprint of the die stack

Electronic device packages and methods for maximizing electrical current to dies and minimizing bond finger size

High density die package configuration on system boards

System in package with interconnected modules

Solderless BGA interconnect

Dual head capillary design for vertical wire bond

Embedded component and methods of making the same

Through mold via (TMV) using stacked modular mold rings

Compact wirebonding in stacked-chip system in package, and methods of making same

I/O layout footprint for multiple 1LM/2LM configurations

ELECTRONICS PACKAGE DEVICES WITH THROUGH-SUBSTRATE-VIAS HAVING PITCHES INDEPENDENT OF SUBSTRATE THICKNESS

Microelectronics package providing increased memory component density

Packaged integrated circuit device with cantilever structure

Buried electrical debug access port

Microelectronic package debug access ports and methods of fabricating the same

Packaged integrated circuit device with cantilever structure

Microelectronic package debug access ports

System-in-package logic and method to control an external packaged memory device