Inventor profile of:

Kinyip Phoa

City:

Beaverton, Oregon

Country:

United States

Published Applications:

27

Last publication date:

2024-11-21

Top Assignees for applications by Kinyip Phoa

The entities that hold a legal rights for patent applications filed by inventor Phoa Kinyip:

Recent patent applications by Phoa Kinyip

Kinyip Phoa from Beaverton, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-11-21
US20240389300A1
Electricity

THREE-DIMENSIONAL MEMORY ARRAYS WITH LAYER SELECTOR TRANSISTORS

#2 | 2024-05-02
US20240145471A1
Electricity

Gate-all-around integrated circuit structures having devices with source/drain-to-substrate electrical contact

#3 | 2024-02-15
US20240055497A1
Electricity

GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING ADJACENT DEEP VIA SUBSTRATE CONTACTS FOR SUB-FIN ELECTRICAL CONTACT

#4 | 2024-02-01
US20240038889A1
Electricity

GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DEVICES WITH CHANNEL-TO-SUBSTRATE ELECTRICAL CONTACT

#5 | 2024-01-04
US20240006504A1
Electricity

Gate-all-around integrated circuit structures having adjacent structures for sub-fin electrical contact

#6 | 2022-05-19
US20220157729A1
Electricity

Semiconductor device having metal interconnects with different thicknesses

#7 | 2022-03-03
US20220068931A1
Electricity

Three-dimensional nanoribbon-based dynamic random-access memory

#8 | 2021-12-02
US20210375926A1
Electricity

THREE-DIMENSIONAL NANORIBBON-BASED TWO-TRANSISTOR MEMORY CELLS

#9 | 2021-10-28
US20210335791A1
Electricity

Three-dimensional memory arrays with layer selector transistors

#10 | 2021-09-02
US20210272624A1
Physics

Three-dimensional nanoribbon-based static random-access memory

#11 | 2021-06-24
US20210193836A1
Electricity

Gate-all-around integrated circuit structures having devices with channel-to-substrate electrical contact

#12 | 2021-06-24
US20210193807A1
Electricity

Gate-all-around integrated circuit structures having adjacent deep via substrate contacts for sub-fin electrical contact

#13 | 2021-06-24
US20210193652A1
Electricity

Gate-all-around integrated circuit structures having devices with source/drain-to-substrate electrical contact

#14 | 2021-06-17
US20210184052A1
Electricity

Three-dimensional nanoribbon-based logic

#15 | 2021-06-17
US20210184014A1
Electricity

Gate-all-around integrated circuit structures having adjacent structures for sub-fin electrical contact

#16 | 2021-05-27
US20210159229A1
Electricity

Three-dimensional nanoribbon-based dynamic random-access memory

#17 | 2021-05-20
US20210151438A1
Electricity

Three-dimensional memory arrays with layer selector transistors

#18 | 2021-03-11
US20210074642A1
Electricity

Semiconductor device having metal interconnects with different thicknesses

#19 | 2020-07-30
US20200243655A1
Electricity

Non-planar integrated circuit structures having asymmetric source and drain trench contact spacing

#20 | 2020-07-23
US20200235249A1
Electricity

FinFET based capacitors and resistors and related apparatuses, systems, and methods

#21 | 2020-06-18
US20200194599A1
Electricity

Metal-oxide-polysilicon tunable resistor for flexible circuit design and method of fabricating same

#22 | 2020-04-02
US20200105861A1
Electricity

Embedded precision resistor for non-planar semiconductor device architectures

#23 | 2019-02-14
US20190051806A1
Electricity

Harvesting energy in an integrated circuit using the seebeck effect

#24 | 2018-05-31
US20180151474A1
Electricity

On-chip through-body-via capacitors and techniques for forming same

#25 | 2018-05-10
US20180130902A1
Electricity

Vertical transistor using a through silicon via gate

#26 | 2017-06-01
US20170155004A1
Electricity

Through silicon via based photovoltaic cell

#27 | 2017-01-26
US20170025533A1
Electricity

Monolithic integration of high voltage transistors and low voltage non-planar transistors

InventorID:

1781869 ⎘