🔗 Permalink

Inventor profile of:

HIDEHIRO TAZAWA

City:

Tokyo

Country:

Japan

Published Applications:

1

Last publication date:

2017-02-23

Top Assignees for applications by HIDEHIRO TAZAWA

The entities that hold a legal rights for patent applications filed by inventor TAZAWA HIDEHIRO:

SHINKAWA LTD. 1 Tokyo, Japan

Recent patent applications by TAZAWA HIDEHIRO

HIDEHIRO TAZAWA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2017-02-23

US20170053889A1

Bonding device

InventorID:

1806604 ⎘