Chandler, Arizona
United States
77
2026-01-15
The entities that hold a legal rights for patent applications filed by inventor May Robert Alan:
Robert Alan May from Chandler, US has applied for patents for these inventions. The list has both pending applications and granted patents:
MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER
#2 | 2026-01-01EMBEDDED BRIDGE WITH PROTECTION LAYER FOR VIA FORMATION WITH BUMP PITCH SCALING
#3 | 2026-01-01HYBRID PANEL WITH A GLASS SUBSTRATE
#4 | 2026-01-01HYBRID PANEL WITH A GLASS SUBSTRATE AND PLATED FRAME
#5 | 2025-12-25INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH REINFORCED GLASS CORES
#6 | 2025-10-16DEVICE AND METHOD OF VERY HIGH DENSITY ROUTING USED WITH EMBEDDED MULTI-DIE INTERCONNECT BRIDGE
#7 | 2025-09-18MULTI-DIE ASSEMBLIES WITH GLASS SUPPORT STRUCTURES
#8 | 2025-08-07DIE INTERCONNECT SUBSTRATE, AN ELECTRICAL DEVICE AND A METHOD FOR FORMING A DIE INTERCONNECT SUBSTRATE
#9 | 2025-07-10MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
#10 | 2025-07-03METHODS AND APPARATUS TO EMBED SEMICONDUCTOR DEVICES IN CORES OF PACKAGE SUBSTRATES
#11 | 2025-07-03RESIST TENTING AND PLATING IN CORE CAVITY FOR COMPONENT ATTACHMENT
#12 | 2025-06-26MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES
#13 | 2025-06-05DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS
#14 | 2025-02-27MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
#15 | 2025-01-02MICROELECTRONIC ASSEMBLIES INCLUDING A PHOTOIMAGEABLE DIELECTRIC FOR HYBRID BONDING AND DIE ENCAPSULATION
#16 | 2024-10-03MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER
#17 | 2024-08-01DEVICE AND METHOD OF VERY HIGH DENSITY ROUTING USED WITH EMBEDDED MULTI-DIE INTERCONNECT BRIDGE
#18 | 2024-07-04OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
#19 | 2024-07-04OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
#20 | 2024-07-04OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
#21 | 2024-07-04OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
#22 | 2024-04-18EMBEDDED DIE ARCHITECTURE AND METHOD OF MAKING
#23 | 2024-04-04ENHANCED SUBTRACTIVE ETCH ANISOTROPY USING ETCH RATE GRADIENT
#24 | 2024-04-04MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER
#25 | 2024-04-04HYBRID PLASMONIC WAVEGUIDE AND METHOD FOR HIGH DENSITY PACKAGING INTEGRATED WITH A GLASS INTERPOSER
#26 | 2024-04-04NANOROD COATING BETWEEN TWO OPTICAL MEDIUMS
#27 | 2024-03-28Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate
#28 | 2024-03-21MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES
#29 | 2024-03-14PATCH ACCOMMODATING EMBEDDED DIES HAVING DIFFERENT THICKNESSES
#30 | 2024-01-25Microelectronic component having molded regions with through-mold vias
#31 | 2023-12-28PACKAGING ARCHITECTURE WITH COAXIAL PILLARS FOR HIGH-SPEED INTERCONNECTS
#32 | 2023-05-11Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate
#33 | 2023-05-04Device and method of very high density routing used with embedded multi-die interconnect bridge
#34 | 2023-05-04Microelectronic component having molded regions with through-mold vias
#35 | 2023-03-23DAM SURROUNDING A DIE ON A SUBSTRATE
#36 | 2022-12-08Device and method of very high density routing used with embedded multi-die interconnect bridge
#37 | 2022-07-21Microelectronic device with embedded die substrate on interposer
#38 | 2022-06-23Electromigration resistant and profile consistent contact arrays
#39 | 2022-06-16FARADAY ROTATOR OPTICAL INTERCONNECTS FOR OPTICAL INSULATOR IN SEMICONDUCTOR SUBSTRATE PACKAGING
#40 | 2022-06-16FARADAY ROTATOR INTERCONNECT AS A THROUGH-VIA CONFIGURATION IN A PATCH ARCHITECTURE
#41 | 2022-06-09Microelectronic component having molded regions with through-mold vias
#42 | 2022-04-07Microelectronic device with embedded die substrate on interposer
#43 | 2022-03-24Embedded multi-die interconnect bridge having a substrate with conductive pathways and a molded material region with through-mold vias
#44 | 2021-12-16Microelectronic structures including bridges
#45 | 2021-11-18RFIC HAVING COAXIAL INTERCONNECT AND MOLDED LAYER
#46 | 2021-10-14Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate
#47 | 2021-09-30Embedded multi-die interconnect bridge having a molded region with through-mold vias
#48 | 2021-09-30Microelectronic component having molded regions with through-mold vias
#49 | 2021-09-30Embedded die architecture and method of making
#50 | 2021-09-09Device and method of very high density routing used with embedded multi-die interconnect bridge
#51 | 2021-08-19Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same
#52 | 2021-05-06Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate
#53 | 2021-03-04Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling
#54 | 2021-02-04Electromigration resistant and profile consistent contact arrays
#55 | 2020-12-10Pseudo-stripline using double solder-resist structure
#56 | 2020-09-24Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same
#57 | 2020-08-20Patch accommodating embedded dies having different thicknesses
#58 | 2020-05-28Semiconductor package having a coaxial first layer interconnect
#59 | 2020-04-02Multi-die microelectronic device with integral heat spreader
#60 | 2020-02-13Die interconnect substrate, an electrical device, and a method for forming a die interconnect substrate
#61 | 2019-12-26RFIC having coaxial interconnect and molded layer
#62 | 2019-12-26Electromigration resistant and profile consistent contact arrays
#63 | 2019-12-26Package substrate having polymer-derived ceramic core
#64 | 2019-11-28Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling
#65 | 2019-11-21Semiconductor device including silane based adhesion promoter and method of making
#66 | 2019-11-07Microelectronic device with embedded die substrate on interposer
#67 | 2019-10-01Electromigration resistant and profile consistent contact arrays
#68 | 2019-08-22Package substrate having copper alloy sputter seed layer and high density interconnects
#69 | 2019-08-15Substrate integrated waveguide
#70 | 2019-06-27Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same
#71 | 2019-05-23Package substrates with integral devices
#72 | 2019-01-03PACKAGE INTEGRATED PASSIVES
#73 | 2018-12-25Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same
#74 | 2018-04-24Metal protected fan-out cavity
#75 | 2018-01-18Package with passivated interconnects
#76 | 2017-09-21Plasma etching of solder resist openings
#77 | 2017-03-02NONDESTRUCTIVE OPTICAL DETECTION OF TRACE UNDERCUT, WIDTH AND THICKNESS
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