Dublin, California
United States
110
2026-04-16
The entities that hold a legal rights for patent applications filed by inventor Wang Rongjun:
Rongjun Wang from Dublin, US has applied for patents for these inventions. The list has both pending applications and granted patents:
SUPERCONFORMAL MOLYBDENUM VIA FILL BY USE OF DEPOSITION GRADIENT CONTROL
#2 | 2026-02-19CHEMICAL PASSIVATION OF MOLYBDENUM PLUG OR TRENCH'S OUTER SURFACE TO PREVENT MO NITRIDATION OR OXIDATION AND MAINTAIN LOW CONTACT RESISTANCE
#3 | 2026-02-19LOW RESISTIVITY AND LOW SURFACE ROUGHNESS TUNGSTEN GROWTH ON BORON NITRIDE INTERFACE
#4 | 2025-10-16METHODS FOR EXTENDING MWBC IN SEMICONDUCTOR PROCESSING CHAMBERS
#5 | 2025-10-16METHODS FOR IMPROVING THROUGHPUT AND GAPFILL QUALITY FOR METAL DEPOSITION
#6 | 2025-09-25SELECTIVE TUNGSTEN NAND DEEP CONTACT GAP BOTTOM FILL
#7 | 2025-05-15Selective metal Capping with Metal Halide enhancement
#8 | 2025-03-06ONE CHAMBER MULTI-STATION SELECTIVE METAL REMOVAL
#9 | 2025-01-02BOTTOM-UP GAP FILL PROCESSES FOR SEMICONDUCTOR SUBSTRATES
#10 | 2024-12-19METAL OXIDE PRECLEAN FOR BOTTOM-UP GAPFILL IN MEOL AND BEOL
#11 | 2024-11-28Method for Metal Gapfill
#12 | 2024-11-07INTERRUPTION LAYER FILL FOR LOW RESISTANCE CONTACTS
#13 | 2024-11-07SILICON NITRIDE DAMAGE-FREE DRY ETCH METHOD FOR TUNGSTEN REMOVAL IN MIDDLE OF LINE BOTTOM-UP TUNGSTEN INTEGRATION
#14 | 2024-10-31LOW-ENERGY UNDERLAYER FOR ROOM TEMPERATURE PHYSICAL VAPOR DEPOSITION OF ELECTRICALLY CONDUCTIVE FEATURES
#15 | 2024-10-24HYBRID MOLYBDENUM FILL SCHEME FOR LOW RESISTIVITY SEMICONDUCTOR APPLICATIONS
#16 | 2024-09-12HYDROGEN PLASMA TREATMENT FOR FORMING LOGIC DEVICES
#17 | 2024-08-22INTEGRATION SOLUTION FOR NAND DEEP CONTACT GAP FILL
#18 | 2024-07-18LOW RESISTIVITY GAPFILL FOR LOGIC DEVICES
#19 | 2024-05-30Method for Gapfill
#20 | 2024-05-30LOW RESISTIVITY GAPFILL
#21 | 2024-05-23METHODS OF REMOVING METAL OXIDE USING CLEANING PLASMA
#22 | 2024-03-28Methods for Forming Low Resistivity Contacts
#23 | 2024-03-14Methods for forming metal gapfill with low resistivity
#24 | 2024-03-14INTEGRATED PVD TUNGSTEN LINER AND SEAMLESS CVD TUNGSTEN FILL
#25 | 2024-02-08TUNGSTEN GAP FILL WITH HYDROGEN PLASMA TREATMENT
#26 | 2024-01-11NITROGEN PLASMA TREATMENT FOR BOTTOM-UP GROWTH
#27 | 2024-01-04PLASMA ENHANCED TUNGSTEN NUCLEATION FOR LOW RESISTIVITY
#28 | 2023-12-28TREATMENT OF TUNGSTEN SURFACE FOR TUNGSTEN GAP-FILL
#29 | 2023-12-14Methods and apparatus for controlling ion fraction in physical vapor deposition processes
#30 | 2023-11-30Selective metal removal with flowable polymer
#31 | 2023-11-23METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
#32 | 2023-10-26METHOD OF IN-SITU SELECTIVE METAL REMOVAL VIA GRADIENT OXIDATION FOR GAPFILL
#33 | 2023-10-26GRADIENT OXIDATION AND ETCH FOR PVD METAL AS BOTTOM LINER IN BOTTOM UP GAP FILL
#34 | 2023-08-17APPARATUS AND METHOD FOR FABRICATING PVD PEROVSKITE FILMS
#35 | 2023-06-15Tungsten Fluoride Soak And Treatment For Tungsten Oxide Removal
#36 | 2023-04-20Methods and apparatus for processing a substrate
#37 | 2023-03-23Top magnets for decreased non-uniformity in PVD
#38 | 2023-03-09SHUTTER DISK FOR PHYSICAL VAPOR DEPOSITION (PVD) CHAMBER
#39 | 2022-12-22Silicon-containing layer for bit line resistance reduction
#40 | 2022-12-22Silicon-containing layer for bit line resistance reduction
#41 | 2022-09-29METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
#42 | 2022-09-29METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
#43 | 2022-03-17METHODS AND APPARATUS FOR IN-SITU DEPOSITION MONITORING
#44 | 2022-01-20Methods and apparatus for controlling ion fraction in physical vapor deposition processes
#45 | 2022-01-13METHODS FOR FORMING STRUCTURES WITH DESIRED CRYSTALLINITY FOR MRAM APPLICATIONS
#46 | 2022-01-06Plasma chamber target for reducing defects in workpiece during dielectric sputtering
#47 | 2021-10-21Oxygen controlled PVD ALN buffer for GAN-based optoelectronic and electronic devices
#48 | 2021-10-14MAGNETIC TUNNEL JUNCTIONS WITH TUNABLE HIGH PERPENDICULAR MAGNETIC ANISOTROPY
#49 | 2021-10-14Methods for treating magnesium oxide film
#50 | 2021-10-14METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
#51 | 2021-06-24Magnetic tunnel junction structures and methods of manufacture thereof
#52 | 2021-03-11METHODS AND APPARATUS FOR CONTROLLING ION FRACTION IN PHYSICAL VAPOR DEPOSITION PROCESSES
#53 | 2020-11-12HIGH PRESSURE RF-DC SPUTTERING AND METHODS TO IMPROVE FILM UNIFORMITY AND STEP-COVERAGE OF THIS PROCESS
#54 | 2020-08-13Magnetic tunnel junctions with tunable high perpendicular magnetic anisotropy
#55 | 2020-06-25METHODS OF CLEANING AN OXIDE LAYER IN A FILM STACK TO ELIMINATE ARCING DURING DOWNSTREAM PROCESSING
#56 | 2020-05-21Magnetic tunnel junctions suitable for high temperature thermal processing
#57 | 2020-04-23Oxygen controlled PVD AlN buffer for GaN-based optoelectronic and electronic devices
#58 | 2020-04-09Methods and apparatus for n-type metal oxide semiconductor (NMOS) metal gate materials using atomic layer deposition (ALD) processes with metal based precursors
#59 | 2020-04-02ARCING TEST VEHICLE AND METHOD OF USE THEREOF
#60 | 2020-03-19Apparatus and methods of fabricating a magneto-resistive random access memory (MRAM) device
#61 | 2020-02-13Physical vapor deposition (PVD) chamber with reduced arcing
#62 | 2019-12-12METHODS AND APPARATUS FOR MAGNETRON ASSEMBLIES IN SEMICONDUCTOR PROCESS CHAMBERS
#63 | 2019-11-28Magnetic tunnel junctions with coupling-pinning layer lattice matching
#64 | 2019-11-14Magnetic tunnel junction structures and methods of manufacture thereof
#65 | 2019-11-05Magnetic tunnel junctions and methods of fabrication thereof
#66 | 2019-10-03Magnetic tunnel junctions with tunable high perpendicular magnetic anisotropy
#67 | 2019-09-26Resistance-area (RA) control in layers deposited in physical vapor deposition chamber
#68 | 2019-06-06Oxygen controlled PVD AlN buffer for GaN-based optoelectronic and electronic devices
#69 | 2019-06-06Magnetic tunnel junctions suitable for high temperature thermal processing
#70 | 2019-02-14METHOD FOR GRADED ANTI-REFLECTIVE COATINGS BY PHYSICAL VAPOR DEPOSITION
#71 | 2019-01-24Magnetic tunnel junctions suitable for high temperature thermal processing
#72 | 2018-12-06Process kit for multi-cathode processing chamber
#73 | 2018-10-11Plasma chamber target for reducing defects in workpiece during dielectric sputtering
#74 | 2018-09-13Oxygen controlled PVD AlN buffer for GaN-based optoelectronic and electronic devices
#75 | 2018-08-23Methods and apparatus for multi-cathode substrate processing
#76 | 2018-08-09Paste method to reduce defects in dielectric sputtering
#77 | 2018-05-24Methods for depositing amorphous silicon layers or silicon oxycarbide layers via physical vapor deposition
#78 | 2018-03-29Process kit shield for improved particle reduction
#79 | 2018-01-11DEPOSITION RING AND ELECTROSTATIC CHUCK FOR PHYSICAL VAPOR DEPOSITION CHAMBER
#80 | 2017-12-07Sputtering target for PVD chamber
#81 | 2017-09-07Methods and apparatus for controlling ion fraction in physical vapor deposition processes
#82 | 2017-06-22Methods and apparatus for processing a substrate
#83 | 2017-06-15Methods for forming structures with desired crystallinity for MRAM applications
#84 | 2017-05-04Methods for thin film material deposition using reactive plasma-free physical vapor deposition
#85 | 2017-02-02High pressure RF-DC sputtering and methods to improve film uniformity and step-coverage of this process
#86 | 2017-01-19Methods for forming structures with desired crystallinity for MRAM applications
#87 | 2016-12-22Methods for depositing dielectric films via physical vapor deposition processes
#88 | 2016-11-24Deposition ring and electrostatic chuck for physical vapor deposition chamber
#89 | 2016-10-06PVD buffer layers for LED fabrication
#90 | 2016-02-04Oxygen controlled PVD AlN buffer for GaN-based optoelectronic and electronic devices
#91 | 2015-12-03Aluminum-nitride buffer and active layers by physical vapor deposition
#92 | 2015-05-14Method for graded anti-reflective coatings by physical vapor deposition
#93 | 2015-04-30METHODS OF FORMING A METAL DIELECTRIC ETCHING STOP LAYER ON A SUBSTRATE WITH HIGH ETCHING SELECTIVITY
#94 | 2015-03-19Extended dark space shield
#95 | 2014-09-18Oxygen controlled PVD aluminum nitride buffer for gallium nitride-based optoelectronic and electronic devices
#96 | 2014-08-28Variable radius dual magnetron
#97 | 2013-10-31PVD buffer layers for LED fabrication
#98 | 2013-05-09DEPOSITION RING AND ELECTROSTATIC CHUCK FOR PHYSICAL VAPOR DEPOSITION CHAMBER
#99 | 2013-04-11PROCESS KIT FOR RF PHYSICAL VAPOR DEPOSITION
#100 | 2012-08-23Uniformity tuning capable ESC grounding kit for RF PVD chamber
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