Daegu
South Korea
6
2023-08-31
The entities that hold a legal rights for patent applications filed by inventor BAE Byungmoon:
Byungmoon BAE from Daegu, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor substrate and method of sawing the same
#2 | 2022-06-30Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by them
#3 | 2022-02-24Semiconductor substrate and method of sawing the same
#4 | 2021-05-27Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by them
#5 | 2018-11-01Package substrates
#6 | 2017-03-16Package substrates
1826478 ⎘