David Clark

City:

Ipswich

Country:

United Kingdom

Published Applications:

Last publication date:

2024-11-21

Top Assignees for applications by David Clark

The entities that hold a legal rights for patent applications filed by inventor Clark David:

FlipChip International, LLC 3 Phoenix, AZ United States
AMKOR TECHNOLOGY, INC. 3 Tempe, AZ United States
Amkor Technology Singapore Holding Pte. Ltd. 3 Singapore, Singapore

Recent patent applications by Clark David

David Clark from Ipswich, GB has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-11-21

US20240387785A1

Electricity

SEMICONDUCTOR DEVICE WITH TRANSMISSIVE LAYER AND MANUFACTURING METHOD THEREOF

#2 | 2023-03-09

US20230074157A1

Electricity

Semiconductor device with transmissive layer and manufacturing method thereof

#3 | 2021-01-21

US20210020813A1

Electricity

Semiconductor device with transmissive layer and manufacturing method thereof

#4 | 2020-03-12

US20200083418A1

Electricity

Semiconductor device with optically-transmissive layer and manufacturing method thereof

#5 | 2018-08-16

US20180233641A1

Electricity

Semiconductor device with optically-transmissive layer and manufacturing method thereof

#6 | 2018-03-08

US20180069163A1

Electricity

Semiconductor device and manufacturing method thereof

#7 | 2013-09-19

US20130244382A1

Electricity

HIGH PRECISION SELF ALIGNING DIE FOR EMBEDDED DIE PACKAGING

#8 | 2013-04-18

US20130093067A1

Electricity

WAFER LEVEL APPLIED RF SHIELDS

#9 | 2013-04-11

US20130087904A1

Electricity

Wafer level applied thermal heat sink

InventorID:

183301 ⎘