Phoenix, Arizona
United States
20
2016-09-15
16
2017-11-28
These are the the leading inventors for applications assigned to FlipChip International, LLC:
FlipChip International, LLC based in Phoenix, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Methods for forming pillar bumps on semiconductor wafers
#2 | 2015-01-01 ✅ Patent 9,070,747 granted on 2015-06-30Electroplating using dielectric bridges
#3 | 2013-12-12 ✅ Patent 8,980,743 granted on 2015-03-17Method for applying a final metal layer for wafer level packaging and associated device
#4 | 2013-09-19HIGH PRECISION SELF ALIGNING DIE FOR EMBEDDED DIE PACKAGING
#5 | 2013-08-01 ✅ Patent 9,627,254 granted on 2017-04-18Method for building vertical pillar interconnect
#6 | 2013-04-18WAFER LEVEL APPLIED RF SHIELDS
#7 | 2013-04-11 ✅ Patent 8,686,556 granted on 2014-04-01Wafer level applied thermal heat sink
#8 | 2013-02-14 ✅ Patent 9,018,750 granted on 2015-04-28Thin film structure for high density inductors and redistribution in wafer level packaging
#9 | 2012-09-13 ✅ Patent 8,446,019 granted on 2013-05-21Solder bump interconnect
#10 | 2012-06-14 ✅ Patent 8,754,524 granted on 2014-06-17Wafer-level interconnect for high mechanical reliability applications
#11 | 2011-08-04 ✅ Patent 8,188,606 granted on 2012-05-29Solder bump interconnect
#12 | 2011-01-06METHODS AND STRUCTURES FOR A VERTICAL PILLAR INTERCONNECT
#13 | 2010-02-11 ✅ Patent 8,058,163 granted on 2011-11-15Enhanced reliability for semiconductor devices using dielectric encasement
#14 | 2009-03-05UNDER BUMP METALLIZATION STRUCTURE HAVING A SEED LAYER FOR ELECTROLESS NICKEL DEPOSITION
#15 | 2008-12-18 ✅ Patent 7,973,418 granted on 2011-07-05Solder bump interconnect for improved mechanical and thermo-mechanical performance
#16 | 2008-04-10 ✅ Patent 8,143,722 granted on 2012-03-27Wafer-level interconnect for high mechanical reliability applications
#17 | 2006-06-06 ✅ Patent 7,057,292 granted on 2006-06-06Solder bar for high power flip chips
#18 | 2005-12-08 ✅ Patent 7,011,988 granted on 2006-03-14Build-up structures with multi-angle vias for Chip to Chip interconnects and optical bussing
#19 | 2005-03-31 ✅ Patent 7,126,164 granted on 2006-10-24Wafer-level moat structures
#20 | 2005-03-31 ✅ Patent 7,118,833 granted on 2006-10-10Forming partial-depth features in polymer film
Also check out Flipchip International, LLC's (Phoenix, United States) applicant profile with 4 patent applications submitted.
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