Suwon-si
South Korea
21
2026-06-18
The entities that hold a legal rights for patent applications filed by inventor Jee Young-kun:
Young-kun Jee from Suwon-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF FABRICATING THE SAME
#2 | 2026-01-15SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#3 | 2026-01-15SEMICONDUCTOR PACKAGE
#4 | 2026-01-08SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
#5 | 2025-03-06SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
#6 | 2024-10-03SEMICONDUCTOR PACKAGE
#7 | 2024-06-13SEMICONDUCTOR PACKAGE
#8 | 2024-05-23SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
#9 | 2024-03-28SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
#10 | 2024-02-29SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF FABRICATING THE SAME
#11 | 2024-01-11SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
#12 | 2015-06-04Substrate of semiconductor package and method of fabricating semiconductor package using the same
#13 | 2015-04-02Semiconductor packages and methods of manufacturing the same
#14 | 2015-02-19Semiconductor package and method of manufacturing the same
#15 | 2014-10-02Semiconductor packages having TSV and adhesive layer
#16 | 2014-02-06Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same
#17 | 2014-01-09Substrate of semiconductor package and method of fabricating semiconductor package using the same
#18 | 2013-12-12METHODS OF TREATING A DEVICE-SUBSTRATE AND SUPPORT-SUBSTRATES USED THEREIN
#19 | 2013-04-11Semiconductor package having an anti-contact layer
#20 | 2012-11-08SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACURING THE SAME
#21 | 2012-09-06SEMICONDUCTOR PACKAGE INCLUDING CONNECTING MEMBER HAVING CONTROLLED CONTENT RATIO OF GOLD
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