Inventor profile of:

Bin Mu

City:

Tempe, Arizona

Country:

United States

Published Applications:

26

Last publication date:

2025-08-28

Top Assignees for applications by Bin Mu

The entities that hold a legal rights for patent applications filed by inventor Mu Bin:

Recent patent applications by Mu Bin

Bin Mu from Tempe, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-08-28
US20250273607A1
Electricity

METHODS AND ARCHITECTURES FOR SHALLOW FIDUCIAL AND METAL DEFINED PAD DESIGNS

#2 | 2025-07-03
US20250218998A1
Electricity

LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING

#3 | 2025-07-03
US20250218926A1
Electricity

MICROELECTRONIC ASSEMBLIES INCLUDING CAVITY-LESS ENCAPSULATED DIES

#4 | 2025-07-03
US20250218880A1
Electricity

MICROELECTRONIC ASSEMBLIES WITH PILLAR-FIRST CONDUCTIVE VIA FORMATION IN GLASS CORES

#5 | 2025-06-26
US20250210426A1
Electricity

MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES

#6 | 2025-06-12
US20250192070A1
Electricity

MICROELECTRONIC ASSEMBLIES WITH POST-SINGULATION EDGE FEATURES IN GLASS CORES

#7 | 2025-06-12
US20250192069A1
Electricity

MICROELECTRONIC ASSEMBLIES WITH PRE-SINGULATION EDGE FEATURES IN GLASS CORES

#8 | 2025-06-12
US20250192059A1
Electricity

EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES

#9 | 2025-06-05
US20250183182A1
Electricity

MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATION IN GLASS CORES

#10 | 2025-06-05
US20250183180A1
Electricity

DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS

#11 | 2025-04-03
US20250112164A1
Electricity

CONTROLLING SUBSTRATE BUMP HEIGHT

#12 | 2025-04-03
US20250112136A1
Electricity

GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS

#13 | 2025-04-03
US20250112085A1
Electricity

APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES

#14 | 2025-03-27
US20250106983A1
Electricity

STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION

#15 | 2024-07-04
US20240222130A1
Electricity

ENABLING COPPER RECESS FLATTENING THROUGH BLOCKED COPPER ETCHING PROCESSES

#16 | 2024-07-04
US20240219660A1
Physics

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

#17 | 2024-06-20
US20240203853A1
Electricity

DRY FILM PHOTORESIST WET LAMINATION AND METHOD

#18 | 2024-06-20
US20240203806A1
Electricity

GLASS LAYER WITH LITHO DEFINED THROUGH-GLASS VIA

#19 | 2023-11-30
US20230383427A1
Chemistry; metallurgy

TWO-DIMENSIONAL METAL-ORGANIC FRAMEWORK ALLOY PHOTOCATALYSTS

#20 | 2022-06-23
US20220192551A1
Human necessities

Biosensor array for the detection of analytes

#21 | 2020-11-12
US20200354845A1
Chemistry; metallurgy

Two-dimensional metal-organic framework alloy photocatalysts

#22 | 2019-09-12
US20190276476A1
Chemistry; metallurgy

TWO-DIMENSIONAL METAL-ORGANIC-FRAMEWORKS

#23 | 2019-05-23
US20190150815A1
Human necessities

Biosensor array for the detection of analytes

#24 | 2017-06-29
US20170182453A1
Performing operations; transporting

Metal-organic framework-based sorbents and methods of synthesis thereof

#25 | 2017-05-25
US20170145599A1
Textiles; paper

METAL-ORGANIC FRAMEWORK COMPOSITES, AND METHODS OF SYNTHESIS THEREOF

#26 | 2017-03-30
US20170092879A1
Electricity

Phototunable metal-organic framework compositions, and methods of synthesis thereof

InventorID:

1839727 ⎘