Teck Sim LEE

City:

Melaka

Country:

Germany

Published Applications:

Last publication date:

2019-03-07

Top Assignees for applications by Teck Sim LEE

The entities that hold a legal rights for patent applications filed by inventor LEE Teck Sim:

Teck Sim LEE from Melaka, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Transistor package with three-terminal clip

Semiconductor chip package comprising side wall marking

InventorID:

1887066 ⎘