Radenthein
Austria
25
2026-04-16
The entities that hold a legal rights for patent applications filed by inventor SCHMOELZER Bernd:
Bernd SCHMOELZER from Radenthein, AT has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR PACKAGES INCLUDING A PACKAGE BODY WITH GROOVES FORMED THEREIN
#2 | 2024-11-28PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP ON ENCAPSULANT
#3 | 2024-07-25METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED SEMICONDUCTOR DIE
#4 | 2024-05-23Semiconductor Package Providing an Even Current Distribution and Stray Inductance Reduction and a Semiconductor Device Module
#5 | 2024-05-16POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
#6 | 2024-02-01Package with electrically insulated carrier and at least one step on encapsulant
#7 | 2024-01-11Semiconductor Package or a Printed Circuit Board, Both Modified to One or More of Reduce, Inverse or Utilize Magnetic Coupling Caused by the Load Current of a Semiconductor Transistor
#8 | 2023-11-09SEMICONDUCTOR PACKAGE HAVING AN EMBEDDED ELECTRICAL CONDUCTOR CONNECTED BETWEEN PINS OF A SEMICONDUCTOR DIE AND A FURTHER DEVICE
#9 | 2023-11-09METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE MODULE WITH INCREASED RELIABILITY AND A SEMICONDUCTOR DEVICE MODULE
#10 | 2023-09-21SEMICONDUCTOR PACKAGES INCLUDING A PACKAGE BODY WITH GROOVES FORMED THEREIN
#11 | 2023-09-07SEMICONDUCTOR PACKAGE AND A SEMICONDUCTOR DEVICE MODULE INCLUDING THE SAME
#12 | 2023-07-20STACKED MODULE ARRANGEMENT
#13 | 2023-04-06EMBEDDED PACKAGE WITH DELAMINATION MITIGATION
#14 | 2023-03-23Semiconductor Package Comprising a Cavity with Exposed Contacts and a Semiconductor Module
#15 | 2022-11-24Method of forming a semiconductor package with connection lug
#16 | 2022-11-24Semiconductor package with connection lug
#17 | 2022-05-19Package with electrically insulated carrier and at least one step on encapsulant
#18 | 2022-05-12Linear spacer for spacing a carrier of a package
#19 | 2022-03-31Semiconductor device module having vertical metallic contacts and a method for fabricating the same
#20 | 2021-08-12Semiconductor device including an embedded semiconductor die
#21 | 2019-09-26Multi-package top-side-cooling
#22 | 2019-03-14SMD package with top side cooling
#23 | 2019-02-21Assembly and method for mounting an electronic component to a substrate
#24 | 2017-06-22Semiconductor devices with improved thermal and electrical performance
#25 | 2017-05-25Semiconductor chip package comprising side wall marking
1887068 ⎘