Incheon
South Korea
34
2023-04-20
The entities that hold a legal rights for patent applications filed by inventor KIM Jae Choon:
Jae Choon KIM from Incheon, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR PACKAGE
#2 | 2023-03-30Semiconductor package
#3 | 2022-11-10Thermoelectric cooling packages
#4 | 2021-12-23Chip on film package and display device including the same
#5 | 2020-09-24Chip on film package and display device including the same
#6 | 2020-05-21Chip structure operating method including heating elements to reduce temperature variation
#7 | 2020-04-30Image sensor package having multi-level stack structure
#8 | 2020-04-30Semiconductor package and method of manufacturing semiconductor package
#9 | 2019-09-19Semiconductor packages
#10 | 2019-09-19Heat radiation device, semiconductor package comprising the same, and semiconductor device comprising the same
#11 | 2019-08-01Semiconductor package including a thermal conductive layer and method of manufacturing the same
#12 | 2019-06-27Electronic device and method of manufacturing the electronic device
#13 | 2019-02-21Chip structure including heating element
#14 | 2018-10-18Semiconductor package
#15 | 2018-05-17Image sensor package having multi-level stack structure
#16 | 2017-08-10Thermoelectric cooling packages and thermal management methods thereof
#17 | 2017-07-20Semiconductor packages having redistribution substrate
#18 | 2017-06-29Surface temperature management method of mobile device and memory thermal management method of multichip package
#19 | 2016-12-22Package substrate and semiconductor package including the same
#20 | 2016-10-13Semiconductor package including heat spreader and method for manufacturing the same
#21 | 2016-08-04Semiconductor package and method of fabricating the same
#22 | 2016-07-14Semiconductor packages with heat dissipation layers and pillars and methods for fabricating the same
#23 | 2016-07-07SEMICONDUCTOR PACKAGES
#24 | 2016-05-12Semiconductor package and semiconductor device including the same
#25 | 2016-03-24Thermoelectric cooling packages and thermal management methods thereof
#26 | 2015-04-30Electronic systems including heterogeneous multi-core processors and methods of operating same
#27 | 2014-10-30APPLICATION PROCESSOR AND DYNAMIC THERMAL MANAGEMENT METHOD THEREOF
#28 | 2014-08-28SEMICONDUCTOR PACKAGE
#29 | 2014-05-15MOBILE DEVICE AND DATA COMMUNICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT OF MOBILE DEVICE
#30 | 2013-08-15SEMICONDUCTOR PACKAGE HAVING HEAT SPREADER AND METHOD OF FORMING THE SAME
#31 | 2013-06-27ELECTRONIC DEVICE AND TEMPERATURE CONTROL METHOD THEREOF
#32 | 2013-06-06Thermoelectric cooling packages and thermal management methods thereof
#33 | 2013-04-11Surface temperature management method of mobile device and memory thermal management method of multichip package
#34 | 2013-01-24Chip-on-film packages and device assemblies including the same
190035 ⎘