Kumar Abhishek Singh

SELF-LOCKING OPTICAL CONNECTOR FOR PHOTONIC INTEGRATED CIRCUITS

GRADED INDEX (GRIN) LENS EXPANDED BEAM (EB) COUPLER FOR DETACHABLE FIBER ARRAY UNIT (FAU)

MICROELECTRONIC STRUCTURES INCLUDING IHS COUPLING ENHANCEMENT STRUCTURES FOR THERMAL DEGRADATION MITIGATION

EXPANDED BEAM FIBER ARRAY UNIT USING SPLICED PHOTONIC CRYSTAL AND MODE FIELD ADAPTER FIBERS

HEAT SPREADERS FOR OPTICAL FIBER ARRAY INTERCONNECTS

PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING A BARRIER MATERIAL TO CONFINE A THERMAL INTERFACE MATERIAL

SINTERABLE NANOPARTICLES FOR ORGANIC-FREE OPTICAL ADHESIVES

LID DESIGN, MATERIALS AND PROCESS FOR PASSIVE FAU ALIGNMENT IN CO-PACKAGE OPTICS

FIBER ARRAY UNIT FOR HIGH DENSITY OPTICAL FIBER CONNECTIONS TO PHOTONIC INTEGRATED CIRCUIT SHORELINES

PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING AN ON-PACKAGE EXPANDED BEAM CONNECTOR FOR DETACHABLE FIBER ARRAY

PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING AN ON-PACKAGE EXPANDED BEAM CONNECTOR FOR DETACHABLE FIBER ARRAY

PACKAGE WITH OPTICAL CONNECTOR

On-Package Self-Aligning Expanded-Beam Connector

EXPANDED BEAM OPTICAL COUPLING WITH A BALL LENS

TAPERED OPTICAL FEATURES FOR OPTICAL FIBER CONNECTIONS

PASSIVE LENS ARRAY STRUCTURE FOR PHOTONIC INTEGRATED CIRCUIT (PIC)

ADHESIVE-FREE EXPANDED BEAM FIBER ARRAY UNIT (FAU)

TECHNOLOGIES FOR FIBER ARRAY UNIT LID DESIGNS

THERMAL INTERFACE STRUCTURES FOR OPTICAL COMMUNICATION DEVICES

Thermal management solutions for integrated circuit packages

Micro-trenching mold interface in a pop package

UNIVERSAL PICK AND PLACE HEAD FOR HANDLING COMPONENTS OF ANY SHAPE