Phoenix, Arizona
United States
6
2021-06-24
The entities that hold a legal rights for patent applications filed by inventor Wang Liwei:
Liwei Wang from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:
3D buildup of thermally conductive layers to resolve die height differences
#2 | 2021-02-25Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage control
#3 | 2019-12-26Coupling a magnet with a MEMS device
#4 | 2019-01-03Apparatus and system for storing and transporting magnetic devices
#5 | 2018-05-17Microelectromechanical system with spring for magnet placement
#6 | 2017-06-15Two material high K thermal encapsulant system
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