Hans-Hermann Oppermann

City:

Berlin

Country:

Germany

Published Applications:

Last publication date:

2025-03-06

Top Assignees for applications by Hans-Hermann Oppermann

The entities that hold a legal rights for patent applications filed by inventor Oppermann Hans-Hermann:

Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. 4 Munich, Germany
Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V 3 Munich, Germany
Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V. 3 Munchen, Germany
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V. 1 MUENCHEN, Germany
Huawei Technologies Duesseldorf GmbH 1 Duesseldorf, Germany
University of Utah Research Foundation 1 Salt Lake City, UT United States
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWAN 1 MUNICH, Germany
Pac Tech- Packaging Technologies GmbH 1 Nauen, Germany
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. 1 , Germany
University of Utah Reasearch Foundation 1 Salt Lake City, UT United States
FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. 1 Munich, Germany

Recent patent applications by Oppermann Hans-Hermann

Hans-Hermann Oppermann from Berlin, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-03-06

US20250079367A1

Electricity

METHOD FOR PRODUCING A SUBSTRATE HAVING A NANOPOROUS BUMP AND CORRESPONDING COMPONENT HAVING A SUBSTRATE WITH NANOPOROUS BUMP

#2 | 2023-01-05

US20230005877A1

Electricity

METHOD FOR MANUFACTURING A SEMICONDUCTOR ARRANGEMENT

#3 | 2022-10-06

US20220319902A1

Electricity

MASSIVE PARALLEL ASSEMBLY METHOD

#4 | 2021-01-21

US20210018687A1

Physics

Optical system, optical components, and method for manufacturing an optical system

#5 | 2021-01-21

US20210018686A1

Physics

Assembly comprising a substrate and two components including optical waveguides, as well as method for production

#6 | 2021-01-21

US20210018679A1

Physics

Markup system for optical system, carrier substrate, and method for manufacturing of same

#7 | 2019-03-21

US20190088490A1

Electricity

Method for manufacturing a semiconductor component and a semiconductor component

#8 | 2017-06-15

US20170170141A1

Electricity

Method for arranging electronic switching elements, electronic switching arrangement and use of a carrier having a bonding layer

#9 | 2015-01-08

US20150010270A1

Physics

Arrangement of a substrate with at least one optical waveguide and with an optical coupling location and of an optoelectronic component, and method for manufacturing such an arrangement

#10 | 2014-09-11