Nauen
Germany
43
2024-11-07
43
2025-07-01
These are the the leading inventors for applications assigned to Pac Tech- Packaging Technologies GmbH:
Pac Tech- Packaging Technologies GmbH based in Nauen, DE has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Method for Soldering an Electronic Component to a Circuit Board by Jetting Liquefied Solder into a Through Hole
#2 | 2024-10-31 ✅ Patent 12,358,084 granted on 2025-07-15Bonding Head and Bonding Apparatus
#3 | 2023-07-13 ✅ Patent 12,485,500 granted on 2025-12-02Method For Monitoring A Laser Soldering Process, And Laser Soldering System Using A Spectroscope Device
#4 | 2023-04-06 ✅ Patent 12,643,167 granted on 2026-06-02Press-Forming Device for Depositing Solder and Producing Individual Solder Bodies
#5 | 2022-11-17 ✅ Patent 12,028,987 granted on 2024-07-02Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole
#6 | 2022-04-28 ✅ Patent 12,171,066 granted on 2024-12-17Method for removing and repositioning electronic components connected to a circuit board
#7 | 2022-04-28 ✅ Patent 12,023,756 granted on 2024-07-02Method for removing electronic components connected to a circuit board
#8 | 2021-09-30 ✅ Patent 12,048,972 granted on 2024-07-30Method and device including laser heating of gripper for repairing a test contact arrangement
#9 | 2021-07-22 ✅ Patent 11,554,434 granted on 2023-01-17Method and laser arrangement for fusing a solder material deposit by means of laser energy
#10 | 2021-06-24 ✅ Patent 11,367,709 granted on 2022-06-21Semiconductor chip stack arrangement and semiconductor chip for producing such a semiconductor chip stack arrangement
#11 | 2020-08-27 ✅ Patent 11,618,094 granted on 2023-04-04Solder ball feeding device
#12 | 2020-05-21 ✅ Patent 11,217,558 granted on 2022-01-04Method and device for establishing a wire connection as well as a component arrangement having a wire connection
#13 | 2019-01-10 ✅ Patent 10,914,759 granted on 2021-02-09Method for placing and contacting a test contact
#14 | 2018-09-13 ✅ Patent 10,634,699 granted on 2020-04-28Device for removing a test contact of a test contact arrangement
#15 | 2017-11-09 ✅ Patent 10,118,240 granted on 2018-11-06Method for forming solder deposits
#16 | 2017-05-11 ✅ Patent 10,354,971 granted on 2019-07-16Method for producing a chip module
#17 | 2016-12-08 ✅ Patent 11,224,928 granted on 2022-01-18Device for the separate application of solder material deposits
#18 | 2016-09-29 ✅ Patent 10,081,068 granted on 2018-09-25Device for the separate application of solder material deposits
#19 | 2016-09-01 ✅ Patent 10,286,470 granted on 2019-05-14Device for the separate application of connecting material deposits
#20 | 2016-08-11 ✅ Patent 9,975,195 granted on 2018-05-22Arrangement and method for the reproducible application of small amounts of liquid
#21 | 2015-12-17 ✅ Patent 9,685,423 granted on 2017-06-20Semiconductor chip assembly and method for manufacturing the same
#22 | 2014-01-30 ✅ Patent 9,649,711 granted on 2017-05-16Method and device for electrically contacting terminal faces of two substrates by laser soldering using a gaseous flux medium
#23 | 2011-10-06 ✅ Patent 8,361,881 granted on 2013-01-29Method for alternately contacting two wafers
#24 | 2011-09-29 ✅ Patent 8,480,298 granted on 2013-07-09Device for positioning and contacting test contacts
#25 | 2011-04-21 ✅ Patent 8,988,094 granted on 2015-03-24Test contact arrangement
#26 | 2011-03-10 ✅ Patent 8,497,578 granted on 2013-07-30Terminal face contact structure and method of making same
#27 | 2010-11-09 ✅ Patent 7,829,817 granted on 2010-11-09Device for removing solder material from a soldered joint
#28 | 2010-08-26 ✅ Patent 8,328,068 granted on 2012-12-11Transfer device for receiving and transferring a solder ball arrangement
#29 | 2010-07-22 ✅ Patent 8,330,076 granted on 2012-12-11Method and device for removing solder material deposits from a substrate
#30 | 2010-03-04 ✅ Patent 9,327,360 granted on 2016-05-03Method and device for contacting, positioning and impinging a solder ball formation with laser energy
#31 | 2009-10-08 ✅ Patent 8,205,325 granted on 2012-06-26Device for applying an electronic component
#32 | 2009-02-05 ✅ Patent 8,087,163 granted on 2012-01-03Method of manufacturing a contact arrangement between a microelectronic component and a carrier
#33 | 2009-01-27 ✅ Patent 7,481,352 granted on 2009-01-27Method for ablating points of contact (debumping)
#34 | 2008-11-20 ✅ Patent 8,256,131 granted on 2012-09-04Method and device for drying circuit substrates
#35 | 2008-09-04 ✅ Patent 9,401,298 granted on 2016-07-26Method and device for transferring a chip to a contact substrate
#36 | 2008-07-17 ✅ Patent 7,882,997 granted on 2011-02-08Method and device for mutual contacting of two wafers
#37 | 2007-11-29 ✅ Patent 7,932,611 granted on 2011-04-26Device for alternately contacting two wafers
#38 | 2007-11-08 ✅ Patent 7,717,316 granted on 2010-05-18Method and device for applying a solder to a substrate
#39 | 2006-08-08 ✅ Patent 7,087,442 granted on 2006-08-08Process for the formation of a spatial chip arrangement and spatial chip arrangement
#40 | 2006-05-23 ✅ Patent 7,049,213 granted on 2006-05-23Method for producing a contact substrate and corresponding contact substrate
#41 | 2006-03-07 ✅ Patent 7,007,834 granted on 2006-03-07Contact bump construction for the production of a connector construction for substrate connecting surfaces
#42 | 2005-10-18 ✅ Patent 6,955,943 granted on 2005-10-18Method for producing a substrate arrangement
#43 | 2005-07-12 ✅ Patent 6,915,940 granted on 2005-07-12Device for applying solder globules
Also check out PAC TECH—PACKAGING TECHNOLOGIES GMBH's (Nauen, Germany) applicant profile with 35 patent applications submitted.
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