Robert Leon SANKMAN

City:

Phoenix, Arizona

Country:

United States

Published Applications:

Last publication date:

2021-03-18

Top Assignees for applications by Robert Leon SANKMAN

The entities that hold a legal rights for patent applications filed by inventor SANKMAN Robert Leon:

INTEL CORPORATION 2 Santa Clara, CA United States

Recent patent applications by SANKMAN Robert Leon

Robert Leon SANKMAN from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2021-03-18

US20210082826A1

Electricity

Semiconductor package having wafer-level active die and external die mount

#2 | 2019-09-12

US20190279938A1

Electricity

Semiconductor package having wafer-level active die and external die mount

#3 | 2017-06-22

US20170179080A1

Electricity

SEMICONDUCTOR PACKAGE INTERPOSER HAVING ENCAPSULATED INTERCONNECTS

InventorID:

1912406 ⎘