Inventor profile of:

Eun Sung LEE

City:

Daejeon

Country:

South Korea

Published Applications:

12

Last publication date:

2018-05-24

Top Assignees for applications by Eun Sung LEE

The entities that hold a legal rights for patent applications filed by inventor LEE Eun Sung:

Recent patent applications by LEE Eun Sung

Eun Sung LEE from Daejeon, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2018-05-24
US20180143325A1
Physics

Method and system for time to first fix (TTFF) reduction of GPS receivers using satellite based augmentation system (SBAS) signal

#2 | 2017-06-29
US20170184723A1
Physics

System and method for determining protection level

#3 | 2011-11-17
US20110282577A1
Physics

Navigation system and method of recognizing traffic lane using the same

#4 | 2010-03-04
US20100050412A1
Performing operations; transporting

Part being centered during assembly process, wafer level parts assembly, and apparatus and method to manufacture wafer level parts assembly

#5 | 2009-05-07
US20090115875A1
Electricity

Image sensor module and fabrication method thereof

#6 | 2008-09-04
US20080213966A1
Electricity

Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device package

#7 | 2008-08-12
US10773312
-

MEMS device and fabrication method thereof

#8 | 2008-01-10
US20080007814A1
Physics

MEMS structure and method of fabricating the same

#9 | 2007-02-06
US10701552
-

Method and apparatus for vacuum-mounting a micro electro mechanical system on a substrate

#10 | 2006-12-28
US20060290457A1
Electricity

Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device package

#11 | 2005-12-13
US10320679
-

MEMS structure having a blocked-sacrificial layer support/anchor and a fabrication method of the same

#12 | 2005-04-26
US10703587
-

Side-bonding method of flip-chip semiconductor device, MEMS device package and package method using the same

InventorID:

1917087 ⎘