Phoenix, Arizona
United States
42
2026-03-12
The entities that hold a legal rights for patent applications filed by inventor Modi Mitul:
Mitul Modi from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:
MULTI-RETICLE DEVICE WITH ELECTRICAL AND OPTICAL STITCHING
#2 | 2026-01-22RECONSTITUTED WAFER-SCALE DEVICES USING SEMICONDUCTOR STRIPS
#3 | 2025-12-25ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES
#4 | 2025-10-163D STACKED I/O CHIPLET ON OPTICAL INTERPOSER FOR HIGH BANDWIDTH APPLICATIONS
#5 | 2025-06-12NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE ARCHITECTURES
#6 | 2024-10-03CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL AND A SOLDER THERMAL INTERFACE MATERIAL
#7 | 2024-04-25Mold shelf package design and process flow for advanced package architectures
#8 | 2024-01-25ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES
#9 | 2023-07-27No mold shelf package design and process flow for advanced package architectures
#10 | 2023-05-04ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES
#11 | 2023-03-23PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES
#12 | 2023-03-23PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES
#13 | 2023-03-16NESTED GLASS PACKAGING ARCHITECTURE FOR HYBRID ELECTRICAL AND OPTICAL COMMUNICATION DEVICES
#14 | 2022-10-27ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES
#15 | 2022-07-28Stacked die cavity package
#16 | 2022-03-31Dummy die structures of a packaged integrated circuit device
#17 | 2022-03-31Chip-scale package architectures containing a die back side metal and a solder thermal interface material
#18 | 2022-03-31DUMMY DIE IN A RECESSED MOLD STRUCTURE OF A PACKAGED INTEGRATED CIRCUIT DEVICE
#19 | 2021-09-30Open cavity bridge power delivery architectures and processes
#20 | 2021-09-30Open cavity bridge co-planar placement architectures and processes
#21 | 2021-08-05Substrate with thermal insulation
#22 | 2021-07-29KEEP OUT ZONE WITH HYDROPHOBIC SURFACE FOR INTEGRATED CIRCUIT (IC) PACKAGE
#23 | 2021-04-08No mold shelf package design and process flow for advanced package architectures
#24 | 2020-12-31Wideband multi-pin edge connector for radio frequency front end module
#25 | 2020-08-27IC DIE PACKAGE THERMAL SPREADER AND EMI SHIELD COMPRISING GRAPHITE
#26 | 2020-08-27Ultra-thin, hyper-density semiconductor packages
#27 | 2020-08-27Active package cooling structures using molded substrate packaging technology
#28 | 2020-08-27Coupled cooling fins in ultra-small systems
#29 | 2020-08-27CRYSTALLINE CARBON HEAT SPREADING MATERIALS FOR IC DIE HOT SPOT REDUCTION
#30 | 2020-07-16Thermal management solutions for integrated circuit packages
#31 | 2020-06-11Stacked die cavity package
#32 | 2019-04-04Thermally coupled package-on-package semiconductor packages
#33 | 2018-12-20Electronic device packages with conformal EMI shielding and related methods
#34 | 2018-06-21Die sidewall interconnects for 3D chip assemblies
#35 | 2018-06-14Semiconductor package with electromagnetic interference shielding structures
#36 | 2017-06-29Electronic device packages with conformal EMI shielding and related methods
#37 | 2017-06-29Electromagnetically shielded electronic devices and related systems and methods
#38 | 2010-06-03Compliant integrated circuit package substrate
#39 | 2008-06-12Compliant structure for an electronic device, method of manufacturing same, and system containing same
#40 | 2008-04-24Embedded capacitors for reducing package cracking
#41 | 2008-01-03Microelectronic assembly having a periphery seal around a thermal interface material
#42 | 2007-12-27Compliant integrated circuit package substrate
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