Rockwall, Texas
United States
19
2026-04-16
The entities that hold a legal rights for patent applications filed by inventor COOK BENJAMIN STASSEN:
BENJAMIN STASSEN COOK from Rockwall, US has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR DEVICE PACKAGE THERMAL CONDUIT
#2 | 2023-09-28HIGH THERMAL CONDUCTIVITY VIAS BY ADDITIVE PROCESSING
#3 | 2021-09-02SEMICONDCTOR DEVICE PACKAGE THERMAL CONDUIT
#4 | 2021-03-25Floating die package
#5 | 2021-01-07Sintered Metal Flip Chip Joints
#6 | 2019-07-25Interconnect via with grown graphitic material
#7 | 2018-08-23Graphene heterolayers for electronic applications
#8 | 2018-05-31Interconnect via with grown graphitic material
#9 | 2018-05-31High thermal conductivity vias by additive processing
#10 | 2018-05-31Integrated circuit nanoparticle thermal routing structure in interconnect region
#11 | 2018-05-31Semiconductor device package thermal conduit
#12 | 2018-05-31Thermal routing trench by additive processing
#13 | 2018-05-31Integrated circuit nanoparticle thermal routing structure over interconnect region
#14 | 2017-11-16Floating die package
#15 | 2017-10-26Lead frame surface modifications for high voltage isolation
#16 | 2017-10-26Sintered Metal Flip Chip Joints
#17 | 2017-10-17Heterostructure interconnects for high frequency applications
#18 | 2017-09-21Printed adhesion deposition to mitigate integrated circuit delamination
#19 | 2017-07-06Printed adhesion deposition to mitigate integrated circuit package delamination
1925000 ⎘