Tokyo
Japan
107
2025-02-20
The entities that hold a legal rights for patent applications filed by inventor MORIKAZU Hiroshi:
Hiroshi MORIKAZU from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
METHOD OF PROCESSING CARBON-CONTAINED MONOCRYSTALLINE SUBSTRATE
#2 | 2024-10-17PROCESSING METHOD AND PROCESSING APPARATUS FOR WORKPIECE
#3 | 2024-07-11LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
#4 | 2024-05-02LASER PROCESSING APPARATUS
#5 | 2024-05-02LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
#6 | 2024-04-25LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
#7 | 2024-04-18METHOD OF PROCESSING WAFER
#8 | 2024-04-18LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
#9 | 2024-02-01LIFT-OFF METHOD
#10 | 2023-12-28LASER PROCESSING APPARATUS
#11 | 2023-12-28LASER PROCESSING APPARATUS
#12 | 2023-12-14LASER PROCESSING APPARATUS
#13 | 2023-10-12Laser processing method
#14 | 2023-07-13Laser processing apparatus
#15 | 2022-05-19CHUCK TABLE AND LASER PROCESSING APPARATUS
#16 | 2021-09-30LASER PROCESSING APPARATUS
#17 | 2021-09-23Inspection apparatus and inspection method
#18 | 2021-01-28Comparing method and laser processing apparatus
#19 | 2020-12-31Laser processing apparatus
#20 | 2020-04-30Laser processing method
#21 | 2020-04-23Laser processing method using plasma light detection for forming a pore in a substrate
#22 | 2020-04-23Laser processing method
#23 | 2019-07-18METHOD OF PROCESSING WORKPIECE WITH LASER BEAM
#24 | 2019-03-21Manufacturing method of III-V compound crystal and manufacturing method of semiconductor device
#25 | 2019-02-21Wafer processing method for dividing a wafer, including a shield tunnel forming step
#26 | 2019-01-10Laser processing apparatus
#27 | 2019-01-10Laser processing apparatus and laser processing method
#28 | 2018-12-20Method of processing wafer
#29 | 2018-09-13Laser processing method and laser processing apparatus
#30 | 2018-09-13Laser processing apparatus
#31 | 2018-08-23Processing method for wafer
#32 | 2018-07-19Method of processing a substrate
#33 | 2018-06-14Substrate processing method
#34 | 2017-12-28Internal crack detecting method and internal crack detecting apparatus
#35 | 2017-11-16Method of sorting chips
#36 | 2017-09-07Wafer processing method
#37 | 2017-08-24Inspecting apparatus and laser processing apparatus
#38 | 2017-08-03Method of processing a substrate
#39 | 2017-06-08Wafer processing method
#40 | 2017-06-08Method of processing wafer
#41 | 2017-03-16Method of processing a substrate
#42 | 2017-03-09Laser processing apparatus
#43 | 2017-01-26Wafer thinning method
#44 | 2016-09-15Method of processing single-crystal substrate
#45 | 2016-09-15Method of processing single-crystal substrate
#46 | 2016-09-08Processing method of single-crystal substrate
#47 | 2016-08-04Method for forming shield tunnels in single-crystal substrates
#48 | 2016-07-14Method for forming a laser processed hole
#49 | 2016-06-16LASER PROCESSING APPARATUS
#50 | 2016-06-09Laser processing method for forming a laser processed hole in a work piece
#51 | 2016-05-05Wafer processing method using pulsed laser beam to form shield tunnels along division lines of a semiconductor wafer
#52 | 2015-12-03Chip manufacturing method
#53 | 2015-11-19Wafer processing method to remove crystal strains
#54 | 2015-11-19Lift-off method
#55 | 2015-09-17Plate-shaped object processing method
#56 | 2015-08-06Lift-off method
#57 | 2015-08-06Lift-off method
#58 | 2015-07-23Separation apparatus
#59 | 2015-05-21Workpiece processing method
#60 | 2015-02-12Optical device wafer processing method
#61 | 2014-11-13Laser processing method
#62 | 2014-09-11Wafer processing method
#63 | 2014-09-04Wafer processing method including a filament forming step and an etching step
#64 | 2014-07-31Laser processing method
#65 | 2014-03-20Method of forming gettering layer
#66 | 2014-01-16Laser processing method
#67 | 2013-10-03Laser processing method and laser processing apparatus
#68 | 2013-09-19Laser processing apparatus
#69 | 2013-08-22Laser processing method and laser processing apparatus
#70 | 2013-08-15LASER PROCESSING APPARATUS SUITABLE FOR FORMATION OF LASER PROCESSED HOLE
#71 | 2013-08-01LASER PROCESSING APPARATUS
#72 | 2013-05-30Optical device wafer processing method
#73 | 2013-05-30Laser processing apparatus
#74 | 2013-04-18Laser processing apparatus including plasma detecting means
#75 | 2009-10-29LASER PROCESSING METHOD FOR TRANSPARENT PLATE
#76 | 2009-09-17LASER BEAM PROCESSING MACHINE
#77 | 2008-10-02Wafer laser processing method and laser processing equipment
#78 | 2008-09-11Laser beam processing machine
#79 | 2008-07-31Method of laser drilling vias
#80 | 2008-05-15Laser beam processing machine
#81 | 2008-03-27Via hole forming method
#82 | 2008-03-20Via hole forming method
#83 | 2008-03-13Laser processing method and laser beam processing machine
#84 | 2008-03-06Via hole depth detector
#85 | 2008-02-28Wafer dividing method
#86 | 2008-02-21Via hole forming method
#87 | 2008-02-07Alignment method of a laser beam processing machine
#88 | 2008-01-24Wafer laser processing method
#89 | 2008-01-17Laser beam processing machine
#90 | 2008-01-17Laser beam processing machine
#91 | 2008-01-17Laser processing device
#92 | 2008-01-10Via hole forming method
#93 | 2008-01-03Method of processing sapphire substrate
#94 | 2007-12-13Via hole forming method
#95 | 2007-10-11Laser beam processing machine
#96 | 2007-06-21Laser beam processing machine
#97 | 2007-05-17Laser beam machine with cylindrical lens system
#98 | 2007-03-01Wafer drilling method
#99 | 2007-02-01Laser processing apparatus
#100 | 2006-11-16Processing apparatus
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