Suwon-si
South Korea
35
2025-08-28
The entities that hold a legal rights for patent applications filed by inventor DING Shaofeng:
Shaofeng DING from Suwon-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR DEVICE
#2 | 2025-08-21SEMICONDUCTOR DEVICE
#3 | 2025-07-03SEMICONDUCTOR DEVICE AND STACK OF SEMICONDUCTOR CHIPS
#4 | 2025-07-03SEMICONDUCTOR DEVICE AND STACK OF SEMICONDUCTOR CHIPS
#5 | 2025-01-09SEMICONDUCTOR DEVICE
#6 | 2025-01-02SEMICONDUCTOR DEVICE
#7 | 2024-11-28SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING SAME
#8 | 2024-07-11SEMICONDUCTOR DEVICE
#9 | 2024-07-04METAL-INSULATOR-METAL CAPACITOR
#10 | 2024-05-30SEMICONDUCTOR DEVICE HAVING THROUGH-VIA STRUCTURE
#11 | 2024-05-16Semiconductor device and stack of semiconductor chips
#12 | 2024-03-28Semiconductor device
#13 | 2023-08-17SEMICONDUCTOR DEVICE
#14 | 2023-06-01INTERPOSER STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#15 | 2023-05-18THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE AND A METHOD OF FABRICATING THE SAME
#16 | 2023-04-27THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#17 | 2022-12-01Metal-insulator-metal capacitor
#18 | 2022-10-20Semiconductor chip and semiconductor package including same
#19 | 2022-10-13Semiconductor device and method of fabricating the same
#20 | 2022-09-01Semiconductor device
#21 | 2022-09-01Semiconductor device
#22 | 2022-08-25Semiconductor device and stack of semiconductor chips
#23 | 2021-09-23Semiconductor devices
#24 | 2021-08-05Semiconductor device and stacked semiconductor chips including through contacts
#25 | 2021-04-29Semiconductor device and method of fabricating the same
#26 | 2021-04-22Interposer structure, semiconductor package comprising the same, and method for fabricating the same
#27 | 2021-04-22Interposer and method of manufacturing the interposer
#28 | 2020-11-05Semiconductor devices
#29 | 2020-10-29Semiconductor device having capacitor
#30 | 2020-07-23Semiconductor device including a capacitor structure and a thin film resistor and a method of fabricating the same
#31 | 2020-04-30Semiconductor device
#32 | 2020-03-05Semiconductor device and method for fabricating the same
#33 | 2020-01-02Semiconductor device having buffer structure surrounding through via
#34 | 2019-05-02Interposer, method of manufacturing interposer, and method of manufacturing semiconductor package
#35 | 2017-07-20Test structure and method of manufacturing structure including the same
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