Junyoung Ko

City:

Cheonan-si

Country:

South Korea

Published Applications:

Last publication date:

2021-05-13

Top Assignees for applications by Junyoung Ko

The entities that hold a legal rights for patent applications filed by inventor Ko Junyoung:

SAMSUNG ELECTRONICS CO., LTD. 3 Gyeonggi-Do, South Korea
SAMSUNG ELECTRONICS CO., LTD. 2 Suwon-si, South Korea
Samsung Electronics Co., Ltd 2 , South Korea
SAMSUNG ELECTRONICS CO. LTD. 1 Suwon-si, Gyeonggi-do, South Korea

Recent patent applications by Ko Junyoung

Junyoung Ko from Cheonan-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2021-05-13

US20210141014A1

Physics

Test apparatuses for testing semiconductor packages and manufacturing systems for manufacturing semiconductor packages having the same and methods of manufacturing the semiconductor packages using the same

#2 | 2021-02-18

US20210050291A1

Electricity

Semiconductor devices

#3 | 2017-12-07

US20170352640A1

Electricity

Removal apparatuses for semiconductor chips

#4 | 2017-02-09

US20170040308A1

Electricity

Method of manufacturing a semiconductor package

#5 | 2017-02-09

US20170040289A1

Electricity

SEMICONDUCTOR PACKAGE

#6 | 2015-06-25

US20150179601A1

Electricity

Removal apparatuses for semiconductor chips

#7 | 2013-01-10

US20130008020A1

Electricity

Removal apparatuses for semiconductor chips

#8 | 2012-01-12

US20120009026A1

Performing operations; transporting

Wafer dicing blade and wafer dicing apparatus including the same

InventorID:

19545 ⎘