Ching Wei HUNG

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2017-08-10

Top Assignees for applications by Ching Wei HUNG

The entities that hold a legal rights for patent applications filed by inventor HUNG Ching Wei:

Ching Wei HUNG from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

FAN-OUT BACK-TO-BACK CHIP STACKED PACKAGES AND THE METHOD FOR MANUFACTURING THE SAME

Substrate and package with micro BGA configuration

Semiconductor package having substrate ID code and its fabricating method

Semiconductor package structure with heat sink

InventorID:

1955437 ⎘