Todd Egan

IN-SITU REFLECTOMETRY FOR REAL-TIME PROCESS CONTROL

#2 | 2026-03-12

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PORTABLE PROCESS TOOL DIAGNOSTIC SYSTEM

#3 | 2025-12-04

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POLARIZED IMAGING REFLECTOMETER

#4 | 2024-05-02

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IN-SITU REFLECTOMETRY FOR REAL-TIME PROCESS CONTROL

#5 | 2024-02-29

US20240071792A1

IN-CHAMBER METROLOGY OF SUBSTRATES FOR PROCESS CHARACTERIZATION AND IMPROVEMENT

#6 | 2024-01-25

US20240027916A1

FINGERPRINTING AND PROCESS CONTROL OF PHOTOSENSITIVE FILM DEPOSITION CHAMBER

#7 | 2023-08-24

US20230266247A1

Metrology for OLED manufacturing using photoluminescence spectroscopy

#8 | 2023-06-22

US20230193466A1

PECVD process

#9 | 2023-03-02

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METHOD AND APPARATUS FOR DETECTION OF PARTICLE SIZE IN A FLUID

#10 | 2022-12-15

US20220399215A1

Substrate process endpoint detection using machine learning

#11 | 2022-12-15

US20220397515A1

OBTAINING SUBSTRATE METROLOGY MEASUREMENT VALUES USING MACHINE LEARNING

#12 | 2022-11-17

US20220367217A1

Image-based in-situ process monitoring

#13 | 2021-12-02

US20210372911A1

Method and apparatus for detection of particle size in a fluid

#14 | 2021-09-16

US20210285865A1

In-situ full wafer metrology system

#15 | 2021-07-08

US20210208077A1

Metrology for OLED manufacturing using photoluminescence spectroscopy

#16 | 2021-01-21

US20210018449A1

Particle detection for substrate processing

#17 | 2020-12-24

US20200399756A1

PECVD process

#18 | 2020-07-16

US20200227294A1

Optical stack deposition and on-board metrology

#19 | 2019-10-17

US20190317021A1

Performing operations; transporting

Metrology for OLED manufacturing using photoluminescence spectroscopy

#20 | 2019-07-25

US20190224723A1

Equipment cleaning apparatus and method

#21 | 2019-07-11

US20190212128A1

In-situ metrology method for thickness measurement during PECVD processes

#22 | 2019-03-07

US20190074201A1

Metrology system for substrate deformation measurement

#23 | 2019-03-07

US20190072497A1

Particle detection for substrate processing

#24 | 2019-02-21

US20190057910A1

Metrology systems with multiple derivative modules for substrate stress and deformation measurement

#25 | 2018-09-13

US20180258535A1

PECVD process

#26 | 2018-04-26

US20180114711A1

Monitoring system for deposition and method of operation thereof

#27 | 2018-03-08

US20180066364A1

PECVD process

#28 | 2018-03-01

US20180057935A1

ENDPOINT DETECTION FOR A CHAMBER CLEANING PROCESS

#29 | 2017-10-05

US20170287752A1

INTEGRATED METROLOGY AND PROCESS TOOL TO ENABLE LOCAL STRESS/OVERLAY CORRECTION

#30 | 2017-01-19

US20170018441A1

Methods and apparatus for substrate edge cleaning

#31 | 2017-01-19

US20170016118A1

PECVD process

#32 | 2016-12-22

US20160370173A1

In-situ metrology method for thickness measurement during PECVD processes

#33 | 2016-07-21

US20160211185A1

Method of aligning substrate-scale mask with substrate

#34 | 2016-06-23

US20160181134A1

Monitoring system for deposition and method of operation thereof

#35 | 2016-02-04

US20160035577A1

Multi-layer mask including non-photodefinable laser energy absorbing layer for substrate dicing by laser and plasma etch

#36 | 2016-01-21

US20160017497A1

PECVD process

#37 | 2015-12-31

US20150376782A1

Wafer placement and gap control optimization through in situ feedback

#38 | 2015-08-13

US20150226540A1

Performing operations; transporting

PECVD apparatus and process

#39 | 2015-08-06

US20150217401A1

Damage isolation by shaped beam delivery in laser scribing process

#40 | 2015-07-23

US20150203966A1

MEASUREMENT OF FILM THICKNESS ON AN ARBITRARY SUBSTRATE

#41 | 2015-05-07

US20150122419A1

LASER AND PLASMA ETCH WAFER DICING WITH A DOUBLE SIDED UV-CURABLE ADHESIVE FILM

#42 | 2015-04-16

US20150102467A1

METHOD OF DICED WAFER TRANSPORTATION

#43 | 2014-12-25

US20140377937A1

Method of coating water soluble mask for laser scribing and plasma etch

#44 | 2014-09-11

US20140251375A1

Methods and apparatus for substrate edge cleaning

#45 | 2014-05-01

US20140118751A1

PECVD process

#46 | 2014-04-17

US20140106542A1

Laser and plasma etch wafer dicing with partial pre-curing of UV release dicing tape for film frame wafer application

#47 | 2014-01-16

US20140017882A1

Method of coating water soluble mask for laser scribing and plasma etch

#48 | 2014-01-16

US20140017879A1

Uniform masking for wafer dicing using laser and plasma etch

#49 | 2014-01-16

US20140015109A1

Method of diced wafer transportation

#50 | 2014-01-09

US20140011337A1

MULTI-LAYER MASK FOR SUBSTRATE DICING BY LASER AND PLASMA ETCH

#51 | 2014-01-02

US20140004685A1

Laser and plasma etch wafer dicing with a double sided UV-curable adhesive film

#52 | 2013-10-24

US20130280890A1

Laser and plasma etch wafer dicing using UV-curable adhesive film

#53 | 2013-04-18

US20130095579A1

METHOD AND APPARATUS FOR THE FORMATION OF SOLAR CELLS WITH SELECTIVE EMITTERS

#54 | 2012-12-20

US20120322241A1

Multi-layer mask for substrate dicing by laser and plasma etch

#55 | 2012-12-20

US20120322240A1

Damage isolation by shaped beam delivery in laser scribing process

#56 | 2011-08-18

US20110200247A1

Method for imaging workpiece surfaces at high robot transfer speeds with correction of motion-induced distortion

#57 | 2011-08-18

US20110199477A1

Method for imaging workpiece surfaces at high robot transfer speeds with reduction or prevention of motion-induced distortion

#58 | 2011-08-18

US20110199476A1

Metrology system for imaging workpiece surfaces at high robot transfer speeds

#59 | 2007-08-23

US20070196011A1