Toronto
Canada
19
2013-04-18
The entities that hold a legal rights for patent applications filed by inventor Mclellan Neil:
Neil Mclellan from Toronto, CA has applied for patents for these inventions. The list has both pending applications and granted patents:
Wafer level packaging of semiconductor chips
#2 | 2012-09-27Method of fabricating a semiconductor chip with supportive terminal pad
#3 | 2012-05-17CIRCUIT BOARD WITH VIA TRACE CONNECTION AND METHOD OF MAKING THE SAME
#4 | 2012-01-19Methods of forming semiconductor chip underfill anchors
#5 | 2011-09-15Methods of forming semiconductor chip underfill anchors
#6 | 2011-06-23Circuit board with via trace connection and method of making the same
#7 | 2011-06-09Conductor bump method and apparatus
#8 | 2011-03-31Circuit board with oval micro via
#9 | 2011-03-03Semiconductor chip with contoured solder structure opening
#10 | 2010-12-23Die stacking apparatus and method
#11 | 2010-10-21Semiconductor chip package with undermount passive devices
#12 | 2010-01-28Under bump metallization for on-die capacitor
#13 | 2009-03-05Wafer level packaging of semiconductor chips
#14 | 2009-02-05Die stacking apparatus and method
#15 | 2009-02-05Under Bump Routing Layer Method and Apparatus
#16 | 2009-02-05Conductor bump method and apparatus
#17 | 2008-10-09CIRCUIT SUBSTRATE WITH PLATED THROUGH HOLE STRUCTURE AND METHOD
#18 | 2008-05-01Flip-Chip Semiconductor Package with Encapsulant Retaining Structure and Strip
#19 | 2008-03-06Method and apparatus for making semiconductor packages
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