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Inventor profile of:

Thomas Laska

City:

Munich

Country:

Germany

Published Applications:

4

Last publication date:

2020-01-09

Top Assignees for applications by Thomas Laska

The entities that hold a legal rights for patent applications filed by inventor Laska Thomas:

  • INFINEON TECHNOLOGIES AG 3 Neubiberg, Germany
  • Infineon Technologies AG 1 , Germany

Recent patent applications by Laska Thomas

Thomas Laska from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2020-01-09
US20200013722A1
Electricity

Silicon carbide semiconductor device having a metal adhesion and barrier structure and a method of forming such a semiconductor device

#2 | 2017-09-21
US20170271268A1
Electricity

Semiconductor device having a metal adhesion and barrier structure and a method of forming such a semiconductor device

#3 | 2010-08-26
US20100213613A1
Electricity

Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same

#4 | 2008-05-29
US20080122091A1
Electricity

Semiconductor device including a power device with first metal layer and second metal layer laterally spaced apart

InventorID:

1991107 ⎘

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