Gilbert, Arizona
United States
45
2025-08-28
The entities that hold a legal rights for patent applications filed by inventor Jain Rahul:
Rahul Jain from Gilbert, US has applied for patents for these inventions. The list has both pending applications and granted patents:
SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STATE THERMAL PERFORMANCE
#2 | 2025-05-08DIE INTERCONNECT SUBSTRATES, A SEMICONDUCTOR DEVICE AND A METHOD FOR FORMING A DIE INTERCONNECT SUBSTRATE
#3 | 2024-08-01PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL
#4 | 2024-06-06PACKAGE WITH UNDERFILL CONTAINMENT BARRIER
#5 | 2024-02-22Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate
#6 | 2023-10-26MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFERENT THICKNESSES
#7 | 2023-10-26SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STATE THERMAL PERFORMANCE
#8 | 2023-08-03Package with underfill containment barrier
#9 | 2022-11-17Methods to selectively embed magnetic materials in substrate and corresponding structures
#10 | 2022-11-10Substrate assembly with encapsulated magnetic feature
#11 | 2022-10-13Methods to embed magnetic material as first layer on coreless substrates and corresponding structures
#12 | 2022-03-03Coreless organic packages with embedded die and magnetic inductor structures
#13 | 2021-12-23Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate
#14 | 2021-05-20Electronic device package including a capacitor
#15 | 2021-03-04SEMICONDUCTOR PACKAGE WITH ATTACHMENT AND/OR STOP STRUCTURES
#16 | 2021-02-04SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STATE THERMAL PERFORMANCE
#17 | 2021-01-21Corner guard for improved electroplated first level interconnect bump height range
#18 | 2021-01-21Protruding SN substrate features for epoxy flow control
#19 | 2020-12-31LITHOGRAPHICALLY DEFINED VERTICAL INTERCONNECT ACCESS (VIA) FOR A BRIDGE DIE FIRST LEVEL INTERCONNECT (FLI)
#20 | 2020-10-01Electronic device package including a capacitor
#21 | 2020-09-17Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrate
#22 | 2020-09-03Coreless organic packages with embedded die and magnetic inductor structures
#23 | 2020-08-06Microelectronic assemblies having conductive structures with different thicknesses
#24 | 2020-08-06Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same
#25 | 2020-06-04SUBSTRATE EMBEDDED HEAT PIPE
#26 | 2020-05-28Semiconductor package having a coaxial first layer interconnect
#27 | 2020-03-05Coreless organic packages with embedded die and magnetic inductor structures
#28 | 2020-02-27Methods to incorporate thin film capacitor sheets (TFC-S) in the build-up films
#29 | 2020-02-27Cavity structures in integrated circuit package supports
#30 | 2020-01-23Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate
#31 | 2020-01-02Methods for attaching large components in a package substrate for advanced power delivery
#32 | 2020-01-02Embedded magnetic inductor
#33 | 2020-01-02CHIP PACKAGE AND METHOD OF MANUFACTURING
#34 | 2020-01-02Patterning of thin film capacitors in organic substrate packages
#35 | 2020-01-02Substrate assembly with encapsulated magnetic feature
#36 | 2019-12-26Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same
#37 | 2019-12-05CREATING A CAVITY USING PLASMA GAS
#38 | 2019-11-21Embedding magnetic material, in a cored or coreless semiconductor package
#39 | 2019-10-03Methods to embed magnetic material as first layer on coreless substrates and corresponding structures
#40 | 2019-10-03Methods to selectively embed magnetic materials in substrate and corresponding structures
#41 | 2019-09-12Thin film barrier seed metallization in magnetic-plugged through hole inductor
#42 | 2019-08-15Substrate integrated waveguide
#43 | 2019-08-08NICKEL-TIN MICROBUMP STRUCTURES AND METHOD OF MAKING SAME
#44 | 2019-08-06Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same
#45 | 2017-09-21Plasma etching of solder resist openings
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