Sheng Li

MICROELECTRONIC ASSEMBLIES INCLUDING A GLASS-CORE WITH POST-SINGULATION EDGE FEATURES

MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER

SUBSTRATE WITH COMPONENT EMBEDDED IN A BLIND CAVITY

METHODS AND ARCHITECTURES FOR SHALLOW FIDUCIAL AND METAL DEFINED PAD DESIGNS

METHODS AND APPARATUS TO REDUCE DISCOLORATION OF SOLDER RESISTS IN IMMERSION COOLING ENVIRONMENTS

VERTICALLY EMBEDDED UTILITY PATCH FOR SEMICONDUCTOR PACKAGES

MICROELECTRONIC ASSEMBLIES WITH CRACK-HEALING MATERIALS FOR GLASS CORES

MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES

SUBSTRATE PROCESS FLOW FOR ENABLING SUBSTRATE TO DIE HYBRID BONDING

MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER

MICROELECTRONIC ASSEMBLIES HAVING POWER DELIVERY ROUTED THROUGH A BRIDGE DIE

Microelectronic device with embedded die substrate on interposer

Microelectronic device with embedded die substrate on interposer

Magnetic core inductors

3D conductive ink printing method and inductor formed thereof

Embedded magnetic inductor

Low z-height, ultra-low dielectric constant air cavity based and multi-core/highly asymmetric antenna substrate architectures for electrical performance improvements in 5G mm-wave applications

Microelectronic device with embedded die substrate on interposer

Formation of tall metal pillars using multiple photoresist layers

Metal protected fan-out cavity

High resolution solder resist material for silicon bridge application

Plasma etching of solder resist openings

Alignment inspection

Methods for fabricating fine line/space (FLS) routing in high density interconnect (HDI) substrates

Coreless substrate package with symmetric external dielectric layers