Tokyo
Japan
7
2026-04-16
The entities that hold a legal rights for patent applications filed by inventor WAKUDA Yohei:
Yohei WAKUDA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
METHOD OF PLATING AND APPARATUS FOR PLATING
#2 | 2025-03-06METHOD OF PLATING AND APPARATUS FOR PLATING
#3 | 2024-09-12PLATING APPARATUS
#4 | 2021-05-27Paddle, plating apparatus equipped with the paddle, and plating method
#5 | 2018-10-04PLATING METHOD
#6 | 2018-08-09Paddle, plating apparatus equipped with the paddle, and plating method
#7 | 2017-09-28Plating method
1997463 ⎘