Kinding
Germany
10
2020-01-16
The entities that hold a legal rights for patent applications filed by inventor Lodermeyer Johannes:
Johannes Lodermeyer from Kinding, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor package with plastic waveguide
#2 | 2019-06-27SEMICONDUCTOR APPARATUSES WITH RADIO-FREQUENCY LINE ELEMENTS, AND ASSOCIATED MANUFACTURING METHODS
#3 | 2019-04-04Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement
#4 | 2019-03-07Methods for producing packaged semiconductor devices
#5 | 2019-02-14Tilted chip assembly for optical devices
#6 | 2018-05-31Semiconductor package with a through port for sensor applications
#7 | 2017-10-05SEMICONDUCTOR DEVICE INCLUDING A MEMS DIE
#8 | 2009-04-30Semiconductor package
#9 | 2008-10-23METHOD OF MAKING AN INTEGRATED CIRCUIT INCLUDING ELECTRODEPOSITION OF ALUMINIUM
#10 | 2008-10-23Method of making an integrated circuit including electrodeposition of metallic chromium
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