San Jose, California
United States
24
2026-03-19
The entities that hold a legal rights for patent applications filed by inventor Smith Mark D.:
Mark D. Smith from San Jose, US has applied for patents for these inventions. The list has both pending applications and granted patents:
SYSTEM AND METHOD FOR OPTIMIZING THROUGH SILICON VIA OVERLAY
#2 | 2025-08-07SYSTEM AND METHOD FOR DETERMINING POST BONDING OVERLAY
#3 | 2025-03-27METHOD TO CALIBRATE, PREDICT, AND CONTROL STOCHASTIC DEFECTS IN EUV LITHOGRAPHY
#4 | 2025-03-27METHOD TO CALIBRATE, PREDICT, AND CONTROL STOCHASTIC DEFECTS IN EUV LITHOGRAPHY
#5 | 2025-03-27METHOD TO CALIBRATE, PREDICT, AND CONTROL STOCHASTIC DEFECTS IN EUV LITHOGRAPHY
#6 | 2025-03-27SYSTEM AND METHOD FOR MITIGATING OVERLAY DISTORTION PATTERNS CAUSED BY A WAFER BONDING TOOL
#7 | 2025-01-30METROLOGY TARGET DESIGN FOR TILTED DEVICE DESIGNS
#8 | 2024-04-11PLASMA HYPERMODEL INTEGRATED WITH FEATURE-SCALE PROFILE MODEL FOR ACCELERATED ETCH PROCESS DEVELOPMENT
#9 | 2024-03-21System and method for determining post bonding overlay
#10 | 2024-02-15System and method for mitigating overlay distortion patterns caused by a wafer bonding tool
#11 | 2023-02-02System and method for mitigating overlay distortion patterns caused by a wafer bonding tool
#12 | 2023-02-02SYSTEM AND METHOD FOR DETECTING PARTICLE CONTAMINATION ON A BONDING TOOL
#13 | 2023-02-02SYSTEM AND METHOD FOR OPTIMIZING THROUGH SILICON VIA OVERLAY
#14 | 2022-01-06Process-induced displacement characterization during semiconductor production
#15 | 2021-07-15System and method for wafer-by-wafer overlay feedforward and lot-to-lot feedback control
#16 | 2019-10-31Process-induced displacement characterization during semiconductor production
#17 | 2018-10-09Systems and methods for fabricating metrology targets with sub-resolution features
#18 | 2018-09-06Layer-to-layer feedforward overlay control with alignment corrections
#19 | 2018-07-12Systems and methods for focus-sensitive metrology targets
#20 | 2018-06-21Metrology recipe generation using predicted metrology images
#21 | 2018-06-07Process compatibility improvement by fill factor modulation
#22 | 2018-04-05System and method for process-induced distortion prediction during wafer deposition
#23 | 2018-01-18Method for computer modeling and simulation of negative-tone-developable photoresists
#24 | 2017-10-05Systems and methods for automated multi-zone detection and modeling
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