Gerald Peter Beyer

City:

Heverlee

Country:

Belgium

Published Applications:

Last publication date:

2021-05-27

Top Assignees for applications by Gerald Peter Beyer

The entities that hold a legal rights for patent applications filed by inventor Beyer Gerald Peter:

IMEC VZW 3 Leuven, Belgium

Recent patent applications by Beyer Gerald Peter

Gerald Peter Beyer from Heverlee, BE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2021-05-27

US20210159207A1

Electricity

Method of direct bonding semiconductor components

#2 | 2018-08-30

US20180247914A1

Electricity

Method of bonding semiconductor substrates

#3 | 2017-10-19

US20170301646A1

Electricity

Method of bonding semiconductor substrates

InventorID:

2016482 ⎘