Beaverton, Oregon
United States
27
2023-11-16
The entities that hold a legal rights for patent applications filed by inventor Subramonium Pramod:
Pramod Subramonium from Beaverton, US has applied for patents for these inventions. The list has both pending applications and granted patents:
PECVD APPARATUS FOR IN-SITU DEPOSITION OF FILM STACKS
#2 | 2022-07-07Depositing a carbon hardmask by high power pulsed low frequency RF
#3 | 2019-12-12PECVD apparatus for in-situ deposition of film stacks
#4 | 2017-05-25Plasma activated conformal dielectric film deposition
#5 | 2017-04-13Methods for formation of low-k aluminum-containing etch stop films
#6 | 2016-01-19Methods of depositing smooth and conformal ashable hard mask films
#7 | 2015-12-31CLEANING OF CARBON-BASED CONTAMINANTS IN METAL INTERCONNECTS FOR INTERCONNECT CAPPING APPLICATIONS
#8 | 2015-08-06Methods and apparatus for selective deposition of cobalt in semiconductor processing
#9 | 2015-07-23Plasma activated conformal dielectric film deposition
#10 | 2015-04-02High selectivity and low stress carbon hardmask by pulsed low frequency RF power
#11 | 2015-01-15PECVD apparatus for in-situ deposition of film stacks
#12 | 2014-08-07Method and apparatus for purging and plasma suppression in a process chamber
#13 | 2014-08-07Plasma activated conformal dielectric film deposition
#14 | 2014-08-07METAL AND SILICON CONTAINING CAPPING LAYERS FOR INTERCONNECTS
#15 | 2014-02-27Methods and apparatus for plasma-based deposition
#16 | 2014-02-27PLASMA CLEAN METHOD FOR DEPOSITION CHAMBER
#17 | 2013-12-05Selective Capping of Metal Interconnect Lines during Air Gap Formation
#18 | 2013-11-26Plasma clean method for deposition chamber
#19 | 2013-07-04In-situ deposition of film stacks
#20 | 2013-06-06Metal and silicon containing capping layers for interconnects
#21 | 2013-02-14Conformal doping via plasma activated atomic layer deposition and conformal film deposition
#22 | 2013-01-10Apparatus including a plasma chamber and controller including instructions for forming a boron nitride layer
#23 | 2012-10-11INCREASING ETCH SELECTIVITY OF CARBON FILMS WITH LOWER ABSORPTION CO-EFFICIENT AND STRESS
#24 | 2012-02-02Plasma activated conformal dielectric film deposition
#25 | 2011-10-06Depositing conformal boron nitride film by CVD without plasma
#26 | 2011-09-29In-situ deposition of film stacks
#27 | 2010-12-09Interfacial capping layers for interconnects
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