Novellus Systems Inc.

Systems and methods for determining film thickness using DC self-bias voltage

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Temperature controlled showerhead

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Temperature controlled showerhead

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Diagnostic and control systems and methods for substrate processing systems using DC self-bias voltage

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Purging of porogen from UV cure chamber

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Contoured showerhead for improved plasma shaping and control

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Multi-station sequential curing of dielectric films

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Multi-station sequential curing of dielectric films

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Single-chamber sequential curing of semiconductor wafers

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Systems and methods for remote plasma atomic layer deposition

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Ceramic showerhead with embedded RF electrode for capacitively coupled plasma reactor

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Purging of porogen from UV cure chamber

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Method and apparatus for purging and plasma suppression in a process chamber

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PLASMA ACTIVATED DEPOSITION OF A CONFORMAL FILM ON A SUBSTRATE SURFACE

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Mechanical engineering

Method for using a purge ring with split baffles in photonic thermal processing systems

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Variable showerhead flow by varying internal baffle conductance

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Method for deposition of conformal films with catalysis assisted low temperature CVD

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Systems and methods for at least partially converting films to silicon oxide and/or improving film quality using ultraviolet curing in steam and densification of films using UV curing in ammonia

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Suppression of parasitic deposition in a substrate processing system by suppressing precursor flow and plasma outside of substrate region

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Point of use valve manifold for semiconductor fabrication equipment

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Diagnostic and control systems and methods for substrate processing systems using DC self-bias voltage

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RF-POWERED, TEMPERATURE-CONTROLLED GAS DIFFUSER

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Methods for modulating step coverage during conformal film deposition

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Purging of porogen from UV cure chamber

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Carousel reactor for multi-station, sequential processing systems

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Continuous plasma and RF bias to regulate damage in a substrate processing system

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Sequential cascading of reaction volumes as a chemical reuse strategy

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Method of plasma activated deposition of a conformal film on a substrate surface

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Purging of porogen from UV cure chamber

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Mechanical suppression of parasitic plasma in substrate processing chamber

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High compressive stress carbon liners for MOS devices

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Systems and methods for controlling etch selectivity of various materials

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PEDESTAL WITH EDGE GAS DEFLECTOR FOR EDGE PROFILE CONTROL

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Protective self-aligned buffer layers for damascene interconnects

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Apparatus and method of effective fluid injection and vaporization for chemical vapor deposition application

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Multistep method of depositing metal seed layers

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Flexible gas mixing manifold

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Transferring heat in loadlocks

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INCREASING ETCH SELECTIVITY OF CARBON FILMS WITH LOWER ABSORPTION CO-EFFICIENT AND STRESS

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Purging of porogen from UV cure chamber

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Closed loop control system for RF power balancing of the stations in a multi-station processing tool with shared RF source

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Systems and methods for inhibiting oxide growth in substrate handler vacuum chambers

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Flowable oxide deposition using rapid delivery of process gases

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Selective capping of copper

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Load lock design for rapid wafer heating

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Ashing method

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Selective electrochemical accelerator removal

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Copper electroplating solutions with halides

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Reduction of a process volume of a processing chamber using a nested dynamic inert volume

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Plating method and apparatus with multiple internally irrigated chambers

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Methods and apparatus for cleaning deposition reactors

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Electroless plating-liquid system

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UV treatment of etch stop and hard mask films for selectivity and hermeticity enhancement

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Cascaded cure approach to fabricate highly tensile silicon nitride films

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System and apparatus for flowable deposition in semiconductor fabrication

#59 | 2012-06-28 ✅ Patent 8,283,644 granted on 2012-10-09

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Physics

Measuring in-situ UV intensity in UV cure tool

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High density plasma etchback process for advanced metallization applications

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Deposit morphology of electroplated copper

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Plasma particle extraction process for PECVD

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Architecture for high throughput semiconductor processing applications

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CVD flowable gap fill

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Modulating etch selectivity and etch rate of silicon nitride thin films

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Methods for monitoring thickness of a conductive layer

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Physics

Fault detection apparatuses and methods for fault detection of semiconductor processing tools

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Methods for reducing UV and dielectric diffusion barrier interaction

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Methods and apparatus for depositing copper on tungsten

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Gas flow distribution receptacles, plasma generator systems, and methods for performing plasma stripping processes

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Thinning tungsten layer after through silicon via filling

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Semiconductive counter electrode for electrolytic current distribution control

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Systems and methods for selective tungsten deposition in vias

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Single-chamber sequential curing of semiconductor wafers

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Method for depositing tungsten film having low resistivity, low roughness and high reflectivity

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Chemical mechanical polishing with multi-zone slurry delivery

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Control of electrolyte composition in a copper electroplating apparatus

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Plasma based photoresist removal system for cleaning post ash residue

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Reducing UV and dielectric diffusion barrier interaction through the modulation of optical properties

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Depositing tungsten into high aspect ratio features

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