Inventor profile of:

Lu Chen

City:

Cupertino, California

Country:

United States

Published Applications:

23

Last publication date:

2025-04-03

Top Assignees for applications by Lu Chen

The entities that hold a legal rights for patent applications filed by inventor Chen Lu:

Recent patent applications by Chen Lu

Lu Chen from Cupertino, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-04-03
US20250112090A1
Electricity

Method Of Forming A Metal Liner For Interconnect Structures

#2 | 2025-01-23
US20250029874A1
Electricity

Low Resistance and High Reliability Metallization Module

#3 | 2024-06-06
US20240183028A1
Chemistry; metallurgy

METHODS AND APPARATUS FOR PRECLEANING AND TREATING WAFER SURFACES

#4 | 2023-05-04
US20230139267A1
Chemistry; metallurgy

Conditioning treatment for ALD productivity

#5 | 2023-03-09
US20230072614A1
Electricity

Method of forming a metal liner for interconnect structures

#6 | 2023-03-09
US20230070489A1
Electricity

DOPED TANTALUM-CONTAINING BARRIER FILMS

#7 | 2022-10-27
US20220344275A1
Electricity

Ruthenium liner and cap for back-end-of-line

#8 | 2022-10-13
US20220328348A1
Electricity

Impurity removal in doped ALD tantalum nitride

#9 | 2022-06-09
US20220181204A1
Electricity

Reverse selective etch stop layer

#10 | 2022-04-21
US20220122923A1
Electricity

METHODS AND MATERIALS FOR ENHANCED BARRIER PERFORMANCE AND REDUCED VIA RESISTANCE

#11 | 2022-04-07
US20220108917A1
Electricity

Low resistance and high reliability metallization module

#12 | 2022-01-27
US20220028795A1
Electricity

Ruthenium liner and cap for back-end-of-line applications

#13 | 2021-12-30
US20210407853A1
Electricity

Impurity removal in doped ALD tantalum nitride

#14 | 2021-12-02
US20210371972A1
Chemistry; metallurgy

Methods and apparatus for precleaning and treating wafer surfaces

#15 | 2021-11-11
US20210351072A1
Electricity

Doping of metal barrier layers

#16 | 2021-09-02
US20210269916A1
Chemistry; metallurgy

Conditioning treatment for ALD productivity

#17 | 2020-11-05
US20200350204A1
Electricity

Selective deposition on non-metallic surfaces

#18 | 2020-11-05
US20200347493A1
Chemistry; metallurgy

Reverse Selective Deposition

#19 | 2019-11-07
US20190341304A1
Electricity

Barrier for copper metallization and methods of forming

#20 | 2013-04-25
US20130098455A1
Chemistry; metallurgy

Multiple complementary gas distribution assemblies

#21 | 2012-11-22
US20120295428A1
Electricity

Methods for pretreatment of group III-nitride depositions

#22 | 2012-11-22
US20120295418A1
Electricity

Methods for improved growth of group III nitride buffer layers

#23 | 2012-11-22
US20120291698A1
Chemistry; metallurgy

Methods for improved growth of group III nitride semiconductor compounds

InventorID:

203548 ⎘