Erwitte
Germany
7
2019-01-03
The entities that hold a legal rights for patent applications filed by inventor Sielaff Michael:
Michael Sielaff from Erwitte, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Molded package with chip carrier comprising brazed electrically conductive layers
#2 | 2018-09-11Molded package with chip carrier comprising brazed electrically conductive layers
#3 | 2018-05-24Method for producing a semiconductor module arrangement
#4 | 2016-04-21Method for Soldering a Circuit Carrier to a Carrier Plate
#5 | 2014-07-24Semiconductor module arrangement and method for producing a semiconductor module arrangement
#6 | 2013-04-25Distribution cabinet for optical fibre cables
#7 | 2012-11-29Support for at least one cassette
203969 ⎘