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Inventor profile of:

Eiichi NISHIMURA

City:

Miyagi

Country:

Japan

Published Applications:

Last publication date:

2020-04-09

Top Assignees for applications by Eiichi NISHIMURA

The entities that hold a legal rights for patent applications filed by inventor NISHIMURA Eiichi:

TOKYO ELECTRON LIMITED 30 Tokyo, Japan

Recent patent applications by NISHIMURA Eiichi

Eiichi NISHIMURA from Miyagi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2020-04-09

US20200111646A1

Electricity

Substrate processing apparatus and substrate processing method

#2 | 2018-11-15

US20180327901A1

Chemistry; metallurgy

Method of cleaning plasma processing apparatus

#3 | 2018-03-22

US20180082823A1

Electricity

Method of etching porous film

#4 | 2018-02-01

US20180033958A1

Electricity

Method for etching magnetic layer including isopropyl alcohol and carbon dioxide

#5 | 2017-08-03

US20170222139A1

Electricity

Method for etching multilayer film

#6 | 2017-08-03

US20170221682A1

Electricity

PLASMA PROCESSING APPARATUS

#7 | 2017-05-11

US20170133233A1

Electricity

Method for processing object to be processed

#8 | 2016-10-20

US20160307734A1

Electricity

Method of processing target object to be processed

#9 | 2016-10-20

US20160307732A1

Electricity

Method of etching porous film

#10 | 2016-09-22

US20160276582A1

Electricity

Method for etching layer to be etched

#11 | 2016-02-11

US20160042970A1

Electricity

Pattern forming method

#12 | 2015-09-03

US20150247235A1

Chemistry; metallurgy

Method of cleaning plasma processing apparatus

#13 | 2015-07-30

US20150214474A1

Electricity

Etching method and substrate processing apparatus

#14 | 2015-05-14

US20150132970A1

Electricity

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

#15 | 2015-04-16

US20150104951A1

Electricity

Method for etching copper layer

#16 | 2015-03-19

US20150079790A1

Electricity

Semiconductor device manufacturing method

#17 | 2015-02-19

US20150050750A1

Electricity

Plasma processing method and plasma processing apparatus

#18 | 2015-02-19

US20150048049A1

Chemistry; metallurgy

Method and apparatus for forming a periodic pattern using a self-assembled block copolymer

#19 | 2015-01-15

US20150013908A1

Electricity

Etching apparatus

#20 | 2014-09-25

US20140287591A1

Electricity

Method for etching film containing cobalt and palladium

#21 | 2014-09-11

US20140251945A1

Chemistry; metallurgy

Method of etching metal layer

#22 | 2014-05-22

US20140141532A1

Electricity

Plasma processing method and plasma processing apparatus

#23 | 2014-05-01

US20140120635A1

Electricity

Etching method and substrate processing apparatus

#24 | 2014-04-24

US20140110373A1

Chemistry; metallurgy

Method of etching copper layer and mask

#25 | 2014-03-27

US20140083979A1

Performing operations; transporting

Deposit removal method

#26 | 2013-08-01

US20130196511A1

Electricity

Etching method and etching apparatus

#27 | 2013-04-25

US20130098868A1

Physics

Dry etching method for metal film

#28 | 2012-09-27

US20120244716A1

Electricity

Substrate processing method and storage medium

#29 | 2012-08-23

US20120214315A1

Electricity

Substrate processing method and storage medium

#30 | 2012-06-28

US20120164839A1

Electricity

Substrate processing method

InventorID:

204360 ⎘