Tokyo
Japan
10,533
2026-10-08
8,608
2026-10-06
Tokyo Electron Limited (TEL) is a Japanese electronics and semiconductor company headquartered in Tokyo, Japan. Founded in 1963, TEL is a leading supplier of semiconductor production equipment and services. It is also a major supplier of flat panel display production equipment and services. TEL's products are used in the manufacture of semiconductors, flat panel displays, and other electronic components. The company has operations in Japan, the United States, Europe, China, and other countries.
These are the the leading inventors for applications assigned to TOKYO ELECTRON LIMITED:
TOKYO ELECTRON LIMITED based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
SYNCHRONIZED MULTI-ARM ROBOT
#2 | 2026-10-08BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD
#3 | 2026-10-08PREDICTION DEVICE AND ETCHING CONTROL SYSTEM
#4 | 2026-10-08MEASURING DEVICE, MEASURING METHOD, AND VACUUM PROCESSING APPARATUS
#5 | 2026-10-08ETCHING METHOD AND PLASMA PROCESSING APPARATUS
#6 | 2026-10-08PLASMA PROCESSING APPARATUS, POWER SOURCE SYSTEM, AND PLASMA PROCESSING METHOD
#7 | 2026-10-08SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
#8 | 2026-10-01ADJUSTABLE CHUCK FOR WAFER BONDING
#9 | 2026-10-01SUBSTRATE PROCESSING SYSTEM, STORAGE MODULE, AND SUBSTRATE PROCESSING METHOD
#10 | 2026-10-01BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD
#11 | 2026-10-01APPARATUS AND METHODS FOR PROCESSING BONDING SEMICONDUCTOR WAFERS
#12 | 2026-10-01BIPOLAR JUNCTION TRANSISTORS WITH NANOSHEET STRUCTURES AND METHODS FOR MANUFACTURING THE SAME
#13 | 2026-10-01SUBSTRATE SUPPORT AND SUBSTRATE PROCESSING APPARATUS
#14 | 2026-10-01SURFACE RELIEF GRATING PERFORMANCE AND COST ENHANCEMENTS FOR AUGMENTED REALITY APPLICATIONS
#15 | 2026-10-01FILM DEPOSITION APPARATUS
#16 | 2026-09-24FORMATION OF LOW-TEMPERATURE AND HIGH-TEMPERATURE IN-SITU DOPED SOURCE AND DRAIN EPITAXY USING SELECTIVE HEATING FOR WRAP-AROUND CONTACT AND VERTICALLY STACKED DEVICE ARCHITECTURES
#17 | 2026-09-24SEPARATION APPARATUS, SEPARATION SYSTEM, AND SEPARATION METHOD
#18 | 2026-09-24SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
#19 | 2026-09-24COMPUTER PROGRAM, INFORMATION PROCESSING APPARATUS, AND INFORMATION PROCESSING METHOD
#20 | 2026-09-17METHOD AND APPARATUS FOR HYBRID BONDING
#21 | 2026-09-17SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
#22 | 2026-09-17BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD
#23 | 2026-09-17SUBSTRATE PROCESSING SYSTEM, SUBSTRATE PROCESSING METHOD, AND NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM
#24 | 2026-09-17SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE TEMPERATURE CONTROL METHOD
#25 | 2026-09-17SUBSTRATE TRANSFER SYSTEM AND TRANSFER MODULE
#26 | 2026-09-17ETCHING METHOD AND PLASMA PROCESSING APPARATUS
#27 | 2026-09-17ANTENNA FOR INDUCTIVELY COUPLED PLASMA EXCITATION, ANTENNA UNIT FOR INDUCTIVELY COUPLED PLASMA EXCITATION, AND PLASMA PROCESSING APPARATUS
#28 | 2026-09-17INFORMATION PROCESSING METHOD, COMPUTER PROGRAM, AND INFORMATION PROCESSING APPARATUS
#29 | 2026-09-17RECIPE TRANSFER OF PLASMA PROCESS USING PLASMA PARAMETERS DETERMINED BY VIRTUAL METROLOGY (VM) FEATURE SELECTION
#30 | 2026-09-17SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
#31 | 2026-09-17SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
#32 | 2026-09-10SUBSTRATE PROCESSING METHOD
#33 | 2026-09-10SUBSTRATE PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
#34 | 2026-09-10PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
#35 | 2026-09-10POWER SUPPLY SYSTEM, PLASMA PROCESSING APPARATUS, AND CONTROL METHOD
#36 | 2026-09-10LITHOGRAPHY APPARATUS
#37 | 2026-09-10HEAT RECLAMATION MULTIPLE WASTE TANKS AT EACH STAGE
#38 | 2026-09-03METHOD AND APPARATUS FOR HYBRID BONDING
#39 | 2026-09-03PLASMA PROCESSING APPARATUS, POWER SUPPLY SYSTEM, AND CONTROL METHOD
#40 | 2026-09-03INFORMATION PROCESSING METHOD, INFORMATION PROCESSING APPARATUS, AND COMPUTER PROGRAM
#41 | 2026-08-27SEMICONDUCTOR PRODUCTION APPARATUS AND INSTALLATION METHOD
#42 | 2026-08-27IN-VACUUM INTEGRATED METROLOGY SENSOR FOR THIN FILM DEPOSITION AND ETCHING APPLICATIONS
#43 | 2026-08-27SUBSTRATE LIQUID PROCESSING METHOD AND SUBSTRATE LIQUID PROCESSING APPARATUS
#44 | 2026-08-27SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS
#45 | 2026-08-27VIRTUAL DISPENSE FLOW-RATE CALIBRATION AND CONTROL ON FLUID DISPENSING TOOLS
#46 | 2026-08-27COMPUTER PROGRAM, INFORMATION PROCESSING METHOD, AND INFORMATION PROCESSING DEVICE
#47 | 2026-08-20LOCALIZED WAFER PRE-COOLING FOR HYPERSPECTRAL IMAGING SYSTEM AND METHOD FOR THREE-DIMENSION (3D) DEFECT ANALYSIS IN WAFERS
#48 | 2026-08-20SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND COMPUTER-READABLE RECORDING MEDIUM
#49 | 2026-08-20SUBSTRATE PROCESSING METHOD
#50 | 2026-08-20SUBSTRATE PROCESSING APPARATUS, TEMPERATURE CONTROL DEVICE, AND TEMPERATURE CONTROL METHOD
#51 | 2026-08-20SUBSTRATE PROCESSING APPARATUS AND COOLING METHOD
#52 | 2026-08-13BONDING LAYER AND PROCESS
#53 | 2026-08-13DESIGN/TOPOGRAPHY BASED Z-HEIGHT & OPTICAL PROXIMITY CORRECTION (OPC) OPTIMIZATION & CO-OPTIMIZATION
#54 | 2026-08-13SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
#55 | 2026-08-13SUBSTRATE PROCESSING APPARATUS AND METHOD OF MAINTAINING DRYING DEVICE IN SUBSTRATE PROCESSING APPARATUS
#56 | 2026-08-13SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
#57 | 2026-08-13SUBSTRATE TRANSFER METHOD, SUBSTRATE PROCESSING APPARATUS, AND PROGRAM
#58 | 2026-08-13MAINTENANCE SYSTEM AND MAINTENANCE METHOD
#59 | 2026-08-06SEQUENTIAL COMPLIMENTARY FET INCORPORATING BACKSIDE POWER DISTRIBUTION NETWORK THROUGH WAFER BONDING PRIOR TO FORMATION OF ACTIVE DEVICES
#60 | 2026-08-06IN-SITU HYBRID BONDING TEST MEASUREMENTS
#61 | 2026-08-06INFORMATION PROCESSING METHOD, COMPUTER PROGRAM, AND INFORMATION PROCESSING APPARATUS
#62 | 2026-07-30SUBSTRATE SUPPORT ASSEMBLY, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD
#63 | 2026-07-30TRANSPORTER AND CONNECTION METHOD
#64 | 2026-07-30INTEGRATED METROLOGY FOR PROCESS CONTROLS IN WAFER BONDING SYSTEM
#65 | 2026-07-30 ✅ Patent 12,757,666 granted on 2026-10-06Mitigation of Capillary Pattern Collapse in Supercritical Dry
#66 | 2026-07-30METHODS FOR IMPROVING ETCH PROFILES OF SEMICONDUCTOR DEVICES
#67 | 2026-07-30SUBSTRATE SUPPORT ASSEMBLY, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD
#68 | 2026-07-30PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
#69 | 2026-07-30UPPER ASSEMBLY AND SUBSTRATE PROCESSING APPARATUS
#70 | 2026-07-23SIGNAL PATH ROUTING IN DIE-TO-DIE BONDED CIRCUITS
#71 | 2026-07-23DEVICE FOR SUBSTRATE PROCESSING SYSTEM AND COMPUTER-READABLE RECORDING MEDIUM
#72 | 2026-07-23ETCHING METHOD AND PLASMA PROCESSING APPARATUS
#73 | 2026-07-23SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
#74 | 2026-07-23ETCHING METHOD AND PLASMA PROCESSING APPARATUS
#75 | 2026-07-23SUBSTRATE PROCESSING APPARATUS AND METHOD FOR OPERATING SUBSTRATE PROCESSING APPARATUS
#76 | 2026-07-23PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
#77 | 2026-07-23PLASMA PROCESSING APPARATUS
#78 | 2026-07-23THERMAL INSULATION STRUCTURE FOR PIPE, PIPE HEATING SYSTEM, THERMAL INSULATION SHEET, AND METHOD OF INSTALLING THERMAL INSULATION STRUCTURE
#79 | 2026-07-16PLASMA PROCESSING APPARATUS AND ETCHING METHOD
#80 | 2026-07-16PLASMA PROCESSING APPARATUS
#81 | 2026-07-16SUBSTRATE PROCESSING APPARATUS AND A SUBSTRATE PROCESSING METHOD
#82 | 2026-07-16SUBSTRATE PROCESSING SYSTEM AND MOVABLE MAINTENANCE APPARATUS
#83 | 2026-07-093D IMAGING BY LIQUID IMMERSION
#84 | 2026-07-09SYSTEM FOR ASSEMBLING COMPONENTS OF SUBSTRATE PROCESSING APPARATUS AND METHOD FOR ASSEMBLING COMPONENTS OF SUBSTRATE PROCESSING APPARATUS
#85 | 2026-07-093D IMAGING BY LIQUID IMMERSION WITH TILT AND/OR ROTATION
#86 | 2026-07-09SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
#87 | 2026-07-09SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING SYSTEM
#88 | 2026-07-02SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING SYSTEM
#89 | 2026-07-02GATE VALVE APPARATUS AND SEMICONDUCTOR MANUFACTURING APPARATUS
#90 | 2026-07-02SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING APPARATUS
#91 | 2026-07-02ETCHING METHOD AND PLASMA PROCESSING APPARATUS
#92 | 2026-06-25PROCESSING APPARATUS AND PROCESSING METHOD
#93 | 2026-06-25PULSE GENERATION CIRCUIT, SUBSTRATE PROCESSING APPARATUS, AND ENERGY REGENERATION METHOD
#94 | 2026-06-25SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
#95 | 2026-06-18TRANSFER METHOD AND TRANSFER APPARATUS FOR SUBSTRATE PROCESSING SYSTEM
#96 | 2026-06-18SELECTIVE CHEMICAL ATOMIC LAYER ETCHING FOR METAL CONTAINING COMPOUNDS
#97 | 2026-06-18PLASMA PROCESSING APPARATUS AND ELECTROSTATIC CHUCK
#98 | 2026-06-18SUBSTRATE PROCESSING DEVICE
#99 | 2026-06-18ETCHING APPARATUS AND ETCHING METHOD
#100 | 2026-06-18SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Also check out Tokyo Electron Limited's (Tokyo, Japan) applicant profile with 6,812 patent applications submitted.
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