Munich
Germany
6
2021-03-18
The entities that hold a legal rights for patent applications filed by inventor Huettinger Michael:
Michael Huettinger from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Chip package, method of forming a chip package and method of forming an electrical contact
#2 | 2020-01-09Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer
#3 | 2019-09-19Method for forming a chip package with compounds to improve the durability and performance of metal contact structures in the chip package
#4 | 2017-11-23Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact
#5 | 2017-11-23Chip package comprising a chemical compound and a method of forming a chip package comprising a chemical compound
#6 | 2017-11-23Chip package and method of forming a chip package
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