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Inventor profile of:

Paul Enquist

City:

Cary, North Carolina

Country:

United States

Published Applications:

7

Last publication date:

2025-08-21

Top Assignees for applications by Paul Enquist

The entities that hold a legal rights for patent applications filed by inventor Enquist Paul:

ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. 4 San Jose, CA United States
Invensas Bonding Technologies, Inc. 2 San Jose, CA United States

Recent patent applications by Enquist Paul

Paul Enquist from Cary, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-08-21

US20250266416A1

STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES

#2 | 2024-05-02

US20240145458A1

Stacked dies and methods for forming bonded structures

#3 | 2023-04-27

US20230131849A1

Stacked dies and methods for forming bonded structures

#4 | 2023-04-27

US20230130580A1

Stacked dies and methods for forming bonded structures

#5 | 2021-06-17

US20210183847A1

Stacked dies and methods for forming bonded structures

#6 | 2019-06-20

US20190189607A1

Stacked dies and methods for forming bonded structures

#7 | 2017-11-23

US20170338214A1

Stacked dies and methods for forming bonded structures

InventorID:

2047432 ⎘